Add to ORKGThis paper reports on successful fabrication of metal through glass via (TGV) for low-loss high-linearity wafer-level 3D packages (WLP). The DC resistance was characterized to 28mOhm/TGV and the non-linearity of two sets of TGVs with a 1.1 mm long transmission line was better than 78 dBm (IP3).QC 20170330</p
In this thesis work the manufacturing of through glass vias (TGVs) is presented. The TGVs were manuf...
Various types of glass substrates have been compared with respect to their suitability as a low-loss...
here is an increasing demand for higher bandwidth (BW) between logic and memory ICs for future smart...
This paper reports on successful fabrication of metal through glass via (TGV) for low-loss high-line...
This letter reports on a new low-loss and high linearity3-D wafer-level interposer technology enable...
Three dimensional (3D) packaging technologies are being developed to address the escalating demand f...
System scaling by 3D packaging is now considered a critical technology enabler for continued increas...
The development of 5G mobile communication created the need for high-frequency communication systems...
Currently glass is mainly used as unstructured wafers or panels with the highest market share in gla...
Novelty / Progress Claims We have developed a new method for fabrication of through-glass vias (TGVs...
Interposers for SiP will become more and more important for advanced electronic systems. But through...
Due to low dielectric loss and low cost, glass is developed as a promising material for advanced int...
In this paper, Silex Microsystems, the world's largest Pure-Play MEMS foundry, together with partner...
As a result of their myriad of advantages over silicon and other conventional substrate technologies...
Glass is well established as wafer or panel substrate for applications like capping of image sensors...
In this thesis work the manufacturing of through glass vias (TGVs) is presented. The TGVs were manuf...
Various types of glass substrates have been compared with respect to their suitability as a low-loss...
here is an increasing demand for higher bandwidth (BW) between logic and memory ICs for future smart...
This paper reports on successful fabrication of metal through glass via (TGV) for low-loss high-line...
This letter reports on a new low-loss and high linearity3-D wafer-level interposer technology enable...
Three dimensional (3D) packaging technologies are being developed to address the escalating demand f...
System scaling by 3D packaging is now considered a critical technology enabler for continued increas...
The development of 5G mobile communication created the need for high-frequency communication systems...
Currently glass is mainly used as unstructured wafers or panels with the highest market share in gla...
Novelty / Progress Claims We have developed a new method for fabrication of through-glass vias (TGVs...
Interposers for SiP will become more and more important for advanced electronic systems. But through...
Due to low dielectric loss and low cost, glass is developed as a promising material for advanced int...
In this paper, Silex Microsystems, the world's largest Pure-Play MEMS foundry, together with partner...
As a result of their myriad of advantages over silicon and other conventional substrate technologies...
Glass is well established as wafer or panel substrate for applications like capping of image sensors...
In this thesis work the manufacturing of through glass vias (TGVs) is presented. The TGVs were manuf...
Various types of glass substrates have been compared with respect to their suitability as a low-loss...
here is an increasing demand for higher bandwidth (BW) between logic and memory ICs for future smart...