Add to ORKGInternational audienceIn the first part of this paper some problems related to the reliability of the Surface Mounted Electronic Assemblies are analysed. An original evaluation of generally occuring faults in SMT boards, based on the cause-effect (Ishikawa) diagrams is developed in the second part of this paper
but there is no room for sloppy practices; SMT assemblies need the control that semiconductor proces...
The significant increase in metal costs has forced the electronics industry to provide new material...
Reliability of MEMS (MicroElectroMechanical-Systems) devices is a crucial aspect as it can discrimin...
This paper presents a method to predict the reliability of electronic components subjected to intens...
This paper will present the research results for reliability of two embedding technologies in compar...
An analysis of the main contributors to the quality and cost of complex board manufacturing is prese...
Solder joints have been an integral part of any electronic assembly. They serve as both the electric...
Microsystems and microelectronics are new technologies that are being increasingly integrated into e...
Different aspects of advanced surface mount package technology have been investigated. Three key are...
Failure analysis and reliability problems habe become very important in recent years in many fields ...
International audienceElectronics components and devices, including equipment to systems, are fabric...
The paper presents an overview of the main causes of failures of modern switching devices as power ...
The development process of today's microsystem technologies for products includes stages of innovati...
This paper discusses the reliability of power electronics modules. The approach taken combines numer...
The reliability of soldered joints in purposively faulty mounted electronic components has been stud...
but there is no room for sloppy practices; SMT assemblies need the control that semiconductor proces...
The significant increase in metal costs has forced the electronics industry to provide new material...
Reliability of MEMS (MicroElectroMechanical-Systems) devices is a crucial aspect as it can discrimin...
This paper presents a method to predict the reliability of electronic components subjected to intens...
This paper will present the research results for reliability of two embedding technologies in compar...
An analysis of the main contributors to the quality and cost of complex board manufacturing is prese...
Solder joints have been an integral part of any electronic assembly. They serve as both the electric...
Microsystems and microelectronics are new technologies that are being increasingly integrated into e...
Different aspects of advanced surface mount package technology have been investigated. Three key are...
Failure analysis and reliability problems habe become very important in recent years in many fields ...
International audienceElectronics components and devices, including equipment to systems, are fabric...
The paper presents an overview of the main causes of failures of modern switching devices as power ...
The development process of today's microsystem technologies for products includes stages of innovati...
This paper discusses the reliability of power electronics modules. The approach taken combines numer...
The reliability of soldered joints in purposively faulty mounted electronic components has been stud...
but there is no room for sloppy practices; SMT assemblies need the control that semiconductor proces...
The significant increase in metal costs has forced the electronics industry to provide new material...
Reliability of MEMS (MicroElectroMechanical-Systems) devices is a crucial aspect as it can discrimin...