Add to ORKGAbstract—This paper investigates the properties of the on-wafer coupled interconnects built in a 0.18µm CMOS technology for RF applications. A SPICE compatible equivalent circuit model is developed. The proposed model is an extension of a 2-Π equivalent circuit model for single-line interconnects by adding two coupling components. The model parameters are extracted from four-port S-parameter simulation results through a calibrated electromagnetic (EM) simulator, i.e., HFSS. The accuracy of the model is validated from 500MHz to 20GHz. 1
A coupled interconnect model is developed using even mode and odd mode capacitance analysis. Signal ...
10.1109/TMTT.2008.919374IEEE Transactions on Microwave Theory and Techniques564942-951IETM
This paper presents an approximate closed-form channel model for a wide range of high-speed intercon...
This paper investigates the properties of the on-wafer interconnects built in a 0.18-µm CMOStechnolo...
This thesis addresses the characterization and modeling of on-wafer interconnects for CMOS RFICs. A ...
This paper investigates the sensitivity of on-wafer coupled interconnects to the Si CMOS process par...
Abstract—A new, comprehensive CAD-oriented modeling methodology for single and coupled interconnects...
Abstract: Purpose – The main aim of this study is the modelling of the interaction of on-chip compon...
In this paper, we introduce the microwave transmission characteristics of interconnection lines on a...
International audienceToday, the performances of integrated electronic circuits are limited by globa...
A coupled interconnect model is developed using even mode and odd mode capacitance analysis. Signal ...
10.1109/RFIC.2007.380885Digest of Papers - IEEE Radio Frequency Integrated Circuits Symposium291-29
We experimentally demonstrate a modeling methodology for inductive parasitics of RFIC interconnects....
10.1109/EMCZUR.2007.4388240Proceedings of the 18th International Zurich Symposium on Electromagnetic...
A model development methodology for complex shaped on-wafer interconn...
A coupled interconnect model is developed using even mode and odd mode capacitance analysis. Signal ...
10.1109/TMTT.2008.919374IEEE Transactions on Microwave Theory and Techniques564942-951IETM
This paper presents an approximate closed-form channel model for a wide range of high-speed intercon...
This paper investigates the properties of the on-wafer interconnects built in a 0.18-µm CMOStechnolo...
This thesis addresses the characterization and modeling of on-wafer interconnects for CMOS RFICs. A ...
This paper investigates the sensitivity of on-wafer coupled interconnects to the Si CMOS process par...
Abstract—A new, comprehensive CAD-oriented modeling methodology for single and coupled interconnects...
Abstract: Purpose – The main aim of this study is the modelling of the interaction of on-chip compon...
In this paper, we introduce the microwave transmission characteristics of interconnection lines on a...
International audienceToday, the performances of integrated electronic circuits are limited by globa...
A coupled interconnect model is developed using even mode and odd mode capacitance analysis. Signal ...
10.1109/RFIC.2007.380885Digest of Papers - IEEE Radio Frequency Integrated Circuits Symposium291-29
We experimentally demonstrate a modeling methodology for inductive parasitics of RFIC interconnects....
10.1109/EMCZUR.2007.4388240Proceedings of the 18th International Zurich Symposium on Electromagnetic...
A model development methodology for complex shaped on-wafer interconn...
A coupled interconnect model is developed using even mode and odd mode capacitance analysis. Signal ...
10.1109/TMTT.2008.919374IEEE Transactions on Microwave Theory and Techniques564942-951IETM
This paper presents an approximate closed-form channel model for a wide range of high-speed intercon...