The latest advances in industrial IGBT module technology

Abstract — More than ten years have elapsed since IGBT modules first emerged as the preferred power semiconductor device for a wide range of industrial applications. During this time IGBT chip and module packaging technology has evolved through multiple generations each with incremental improvements in performance and reliability. At the same time optimized processing techniques and improved yields have reduced the cost of chip manufacturing. As a result, there are often attractive opportunities to upgrade the performance of industrial power conversion equipment while simultaneously reducing cost. This paper will summarize the latest advances in IGBT technology and the implications for future applications. Keywords- IGBT module; IGBT chip; Module package I