One of the remarkable characteristics of SiGe HBT is the ability to operate over a wide tem-perature range, from as low as sub 1K, to as high as over 400 K. The SiGe HBT investigated and measured in this work is a first-generation, 0.5 mm SiGe HBT with fT = fmax of 50 GHz/65 GHz and BVCEO=BVCBO of 3.3 V/10.5 V at 300 K. The base doping is below but close to the Mott-transition (about 31018 cm3 for boron in silicon). In this dissertation, some important SiGe HBTs physics at cryogenic temperature are analyzed. New compact models equations for SiGe HBT are devel-oped, which can function from 43 to 393K. Device TCAD simulations are used to help understand the device physics at cryogenic temperatures. First, the temperature dependence of semicon...
The influence of Ge profile shape on the temperature characteristics of two key analog transistor pa...
The SiGe HBT is a good candidate for MIC, MMIC and high speed logic circuits below 50GHz at ambient ...
BiCMOS technology can be a possible replacement for FDSOI and FinFET technology due to their higher ...
One of the remarkable characteristics of SiGe HBT is the abil-ity to operate over a wide temperature...
In this work, the numerical simulation of a SiGe heterojunction bipolar transistor (HBT) for DC and ...
The silicon germanium heterojunction bipolar transistor, SiGe HBT, has very high frequency response ...
This paper describes SCORPIO, a new one-dimensional, drift-diffusion simulator for modeling silicon-...
Abstract: We demonstrate that high-injection barrier effects associated with the collector-base sili...
Abstract: The recent introduction of silicon-germanium (SiGe) alloys has proven exceptionally promis...
Abstract — The high-frequency behavior and power capability of SiGe HBTs with selectively implanted...
The increasing complexity of power electronic systems needed for advanced deep space missions and mi...
Abstract: This paper describes SCORPIO, a new one-dimensional, drift-diffusion simulator for modelin...
Abstract — This paper examines modeling of IC-VBE from 43 to 400 K in a 50 GHz peak fT SiGe HBT tech...
We present a comprehensive investigation of the cryogenic performance of third-generation silicon–ge...
This thesis investigates the low temperature characterization of Si bipolar junction transistors and...
The influence of Ge profile shape on the temperature characteristics of two key analog transistor pa...
The SiGe HBT is a good candidate for MIC, MMIC and high speed logic circuits below 50GHz at ambient ...
BiCMOS technology can be a possible replacement for FDSOI and FinFET technology due to their higher ...
One of the remarkable characteristics of SiGe HBT is the abil-ity to operate over a wide temperature...
In this work, the numerical simulation of a SiGe heterojunction bipolar transistor (HBT) for DC and ...
The silicon germanium heterojunction bipolar transistor, SiGe HBT, has very high frequency response ...
This paper describes SCORPIO, a new one-dimensional, drift-diffusion simulator for modeling silicon-...
Abstract: We demonstrate that high-injection barrier effects associated with the collector-base sili...
Abstract: The recent introduction of silicon-germanium (SiGe) alloys has proven exceptionally promis...
Abstract — The high-frequency behavior and power capability of SiGe HBTs with selectively implanted...
The increasing complexity of power electronic systems needed for advanced deep space missions and mi...
Abstract: This paper describes SCORPIO, a new one-dimensional, drift-diffusion simulator for modelin...
Abstract — This paper examines modeling of IC-VBE from 43 to 400 K in a 50 GHz peak fT SiGe HBT tech...
We present a comprehensive investigation of the cryogenic performance of third-generation silicon–ge...
This thesis investigates the low temperature characterization of Si bipolar junction transistors and...
The influence of Ge profile shape on the temperature characteristics of two key analog transistor pa...
The SiGe HBT is a good candidate for MIC, MMIC and high speed logic circuits below 50GHz at ambient ...
BiCMOS technology can be a possible replacement for FDSOI and FinFET technology due to their higher ...