Abstract—In this paper, the interfacial adhesion strength be-tween metal layer and benzocyclobutene (BCB) polymer dielectric in 3-D integration applications is investigated. The effects of layer thickness, layer stacking order, and additional adhesion layer of titanium (Ti) layer between copper (Cu) and BCB polymer are investigated. Surprisingly, the conventional titanium adhesion layer commonly used in the semiconductor industry weakens the interfacial adhesion strength between copper and BCB. Addition-ally, to figure out the interfacial adhesion mechanisms, the inter-facial structures probed by sum-frequency-generation vibrational spectroscopy are correlated to the adhesion strengths measured from corresponding sample interfaces. It is fo...
The polymer/metal adhesion was studied using the system polycyanurat on aluminum. As an approach of ...
Recent studies into the nature of bonding at the interface between two solids in contact or a solid ...
Our research is dedicated to a study of an interface between a Bi2Se3 topological insulator (TI) and...
The effects of the different surface modification methods on the adhesion of electroless and sputter...
The interfacial adhesion in a WLP structure was evaluated. The focus was not on absolute adhesion va...
Adhesion is important to a variety of applications and for a number of industries. Adhesion occurs a...
Thesis (Ph.D.), Mechanical Engineering, Washington State UniversityInterfaces play an important role...
A fundamental knowledge and understanding of the adhesion behaviour of metal polymer systems is impo...
We investigate the adhesion strength of poly(butylene terephthalate) or PBT on aluminum using densit...
The strength of adhesion between two over-moulded polymers, methylmethacrylate-butadiene-styrene cop...
3D stacking, one of the 3D integration technologies using through silicon vias (TSVs), is considered...
Integrating low dielectric permittivity (low-k) polymers to metals is an exacting fundamental challe...
Numerous mechanisms have been identified as fundamental to the adhesion of thin metallic films. The ...
A comprehensive study is made of the effects of dimple and finishing material of copper alloy lead f...
Abstract—The adhesion at interfaces between dissimilar materials is strongly aected by both segregat...
The polymer/metal adhesion was studied using the system polycyanurat on aluminum. As an approach of ...
Recent studies into the nature of bonding at the interface between two solids in contact or a solid ...
Our research is dedicated to a study of an interface between a Bi2Se3 topological insulator (TI) and...
The effects of the different surface modification methods on the adhesion of electroless and sputter...
The interfacial adhesion in a WLP structure was evaluated. The focus was not on absolute adhesion va...
Adhesion is important to a variety of applications and for a number of industries. Adhesion occurs a...
Thesis (Ph.D.), Mechanical Engineering, Washington State UniversityInterfaces play an important role...
A fundamental knowledge and understanding of the adhesion behaviour of metal polymer systems is impo...
We investigate the adhesion strength of poly(butylene terephthalate) or PBT on aluminum using densit...
The strength of adhesion between two over-moulded polymers, methylmethacrylate-butadiene-styrene cop...
3D stacking, one of the 3D integration technologies using through silicon vias (TSVs), is considered...
Integrating low dielectric permittivity (low-k) polymers to metals is an exacting fundamental challe...
Numerous mechanisms have been identified as fundamental to the adhesion of thin metallic films. The ...
A comprehensive study is made of the effects of dimple and finishing material of copper alloy lead f...
Abstract—The adhesion at interfaces between dissimilar materials is strongly aected by both segregat...
The polymer/metal adhesion was studied using the system polycyanurat on aluminum. As an approach of ...
Recent studies into the nature of bonding at the interface between two solids in contact or a solid ...
Our research is dedicated to a study of an interface between a Bi2Se3 topological insulator (TI) and...