Add to ORKGnd Ae se h, ele nt dist, we ere f plicat 374 A ugust interconnect material, copper is the best choice due to its higher electrical conductivity and electromigration resistance.6,7 For the technique.11 The diameter of the fabricated copper interconnects is e Lett 20.00 Downlopurpose of depositing metal in deep through-holes, electroplating is the most widely used process.6-8 Although the earlier reported interconnects have shown satis
Aluminum is the current metal of choice for metallization in the IC industry. However, serious elect...
170 p.With changing materials systems and interconnect architectures from Al based metallization to ...
As a superior substituent for the chemical-vapor deposition and physical-vapor deposition ~PVD! Cu ...
There is great interest in the semiconductor industry to move to copper for advanced interconnect pr...
The copper electroplating process for dual damascene metallization of semiconductor interconnects i...
We have utilized electroplating technology in a damascene process to produce low resistance copper i...
Copper is the metal of choice for interconnects in microelectronic devices because of its favorably ...
In the electronics industry, interconnect is defined as a conductive connection between two or more ...
Aluminum is the current metal of choice for metallization in the IC industry. However, serious elect...
Abstract − Cu interconnection in electronic devices is fabricated via damascene process including Cu...
An in-depth study of the copper electroplating process was carried out with different process parame...
[[abstract]]A method of manufacturing copper interconnects includes the steps of first providing a s...
The development of high density interconnects (HDI) for IC packaging substrate and printed circuit b...
In the electronics industry, interconnect is defined as a conductive connection between two or more ...
Electrodeposition is the preferred method for building multilayer, sub-micron, Cu interconnect struc...
Aluminum is the current metal of choice for metallization in the IC industry. However, serious elect...
170 p.With changing materials systems and interconnect architectures from Al based metallization to ...
As a superior substituent for the chemical-vapor deposition and physical-vapor deposition ~PVD! Cu ...
There is great interest in the semiconductor industry to move to copper for advanced interconnect pr...
The copper electroplating process for dual damascene metallization of semiconductor interconnects i...
We have utilized electroplating technology in a damascene process to produce low resistance copper i...
Copper is the metal of choice for interconnects in microelectronic devices because of its favorably ...
In the electronics industry, interconnect is defined as a conductive connection between two or more ...
Aluminum is the current metal of choice for metallization in the IC industry. However, serious elect...
Abstract − Cu interconnection in electronic devices is fabricated via damascene process including Cu...
An in-depth study of the copper electroplating process was carried out with different process parame...
[[abstract]]A method of manufacturing copper interconnects includes the steps of first providing a s...
The development of high density interconnects (HDI) for IC packaging substrate and printed circuit b...
In the electronics industry, interconnect is defined as a conductive connection between two or more ...
Electrodeposition is the preferred method for building multilayer, sub-micron, Cu interconnect struc...
Aluminum is the current metal of choice for metallization in the IC industry. However, serious elect...
170 p.With changing materials systems and interconnect architectures from Al based metallization to ...
As a superior substituent for the chemical-vapor deposition and physical-vapor deposition ~PVD! Cu ...