Finite-element calculations of Schottky diode capacitance-voltage (C-V) curves show that an array of subsurface inclined quantum wells (QWs) produce negligible change in shape and slope of C-V curves, but significantly reduce the intercept voltage. This is particularly important for hexagonal SiC, in which current- or process-induced cubic inclusions are known to behave as electron QWs. These calculations naturally explain the surprisingly large effect of cubic inclusions on the apparent 4H-SiC Schottky barrier determined by C-V measurements, and together with the measured C-V data indicate the QW subband energy in the inclusions to be ~0.51 eV below the host 4H-SiC conduction band.open151
The metal-semiconductor (MS) Schottky barrier junction, formed by putting a metal in contact with a ...
Graphene, a semimetal with linear energy dispersion, forms Schottky junction when interfaced with a ...
Silicon Carbide Metal-Oxide-Semiconductor is an attractive material for power electronic application...
We show that "single" stacking fault 3C inclusions formed in 4H-SiC p-i-n diodes behave as...
Using ballistic electron emission microscopy (BEEM), high-temperature- processing-induced 'double-st...
SiC is a polytypic material that may crystallize in many different close-packing sequences with cubi...
High-temperature-processing-induced “double-stacking fault” cubic inclusions in 4H-SiC were studied ...
In this article Schottky barrier diodes comprising of a n-n germanium-silicon carbide (Ge-SiC) heter...
High-quality Schottky junctions have been fabricated on n-type 4H SiC epitaxial layers grown by chem...
p-type Schottky barriers in Pt/3C-SiC contacts have been measured using ballistic hole emission micr...
SiC p-i-n diodes exhibit an increase in the voltage drop under forward bias which has been linked wi...
The electrical properties of planar 8H stacking-fault inclusions (SFIs) formed during epilayer growt...
Ballistic electron emission microscopy was used to measure the increase of local Schottky barrier (c...
The ability of cubic phase (3C-) Silicon Carbide (SiC) to grow heteroepitaxially on Silicon (Si) sub...
For the first time, the I-V-T dataset of a Schottky diode has been accurately modelled, parameterise...
The metal-semiconductor (MS) Schottky barrier junction, formed by putting a metal in contact with a ...
Graphene, a semimetal with linear energy dispersion, forms Schottky junction when interfaced with a ...
Silicon Carbide Metal-Oxide-Semiconductor is an attractive material for power electronic application...
We show that "single" stacking fault 3C inclusions formed in 4H-SiC p-i-n diodes behave as...
Using ballistic electron emission microscopy (BEEM), high-temperature- processing-induced 'double-st...
SiC is a polytypic material that may crystallize in many different close-packing sequences with cubi...
High-temperature-processing-induced “double-stacking fault” cubic inclusions in 4H-SiC were studied ...
In this article Schottky barrier diodes comprising of a n-n germanium-silicon carbide (Ge-SiC) heter...
High-quality Schottky junctions have been fabricated on n-type 4H SiC epitaxial layers grown by chem...
p-type Schottky barriers in Pt/3C-SiC contacts have been measured using ballistic hole emission micr...
SiC p-i-n diodes exhibit an increase in the voltage drop under forward bias which has been linked wi...
The electrical properties of planar 8H stacking-fault inclusions (SFIs) formed during epilayer growt...
Ballistic electron emission microscopy was used to measure the increase of local Schottky barrier (c...
The ability of cubic phase (3C-) Silicon Carbide (SiC) to grow heteroepitaxially on Silicon (Si) sub...
For the first time, the I-V-T dataset of a Schottky diode has been accurately modelled, parameterise...
The metal-semiconductor (MS) Schottky barrier junction, formed by putting a metal in contact with a ...
Graphene, a semimetal with linear energy dispersion, forms Schottky junction when interfaced with a ...
Silicon Carbide Metal-Oxide-Semiconductor is an attractive material for power electronic application...