p-type Schottky barriers in Pt/3C-SiC contacts have been measured using ballistic hole emission microscopy (BHEM) and estimated to be ???0.06 eV higher than identically prepared Pt/p-type 4H-SiC contacts. This indicates the 3C-SiC valence band maximum (VBM) is ???0.06 eV below the 4H-SiC VBM, consistent with the calculated ???0.05 eV type-II valence band offset between these polytypes. We also observe no evidence of an additional VBM in 3C-SiC, which supports the proposal that the second VBM observed in BHEM spectra on 4H-SiC is a crystal-field split VBM located ???110 meV below the highest VBM.open6
Emerging wide bandgap semiconductor devices such as the ones built with SiC have the potential to re...
The Au/Ni/Al2O3/4H-SiC junction with the Al2O3 film as a thin spacer layer was found to show the ele...
This letter reports on initial investigation results on the material quality and device suitability ...
We show that "single" stacking fault 3C inclusions formed in 4H-SiC p-i-n diodes behave as...
Using ballistic electron emission microscopy (BEEM), high-temperature- processing-induced 'double-st...
Ballistic electron emission microscopy (BEEM) measurements have been performed on Pt/p-type 4H-SiC S...
SiC is a polytypic material that may crystallize in many different close-packing sequences with cubi...
Abstract: We have performed ballistic-electron emission microscopy (BEEM) of Pd and Pt Schottky con...
Ballistic electron-emission spectroscopy (BEES) and photoluminescence are used to study conduction-b...
Abstract: We report ballistic-electron emission microscopy (BEEM) investigation of Pd, Pt Schottky ...
Ballistic electron emission microscopy was used to measure the increase of local Schottky barrier (c...
The ability of cubic phase (3C-) Silicon Carbide (SiC) to grow heteroepitaxially on Silicon (Si) sub...
During the 2001-2002 award period, we performed research on Pt/Ti/bare 6H-SiC and bare 4H-SiC interf...
In this article Schottky barrier diodes comprising of a n-n germanium-silicon carbide (Ge-SiC) heter...
High-temperature-processing-induced double-stacking-fault 3C−SiC inclusions in 4H SiC were studied...
Emerging wide bandgap semiconductor devices such as the ones built with SiC have the potential to re...
The Au/Ni/Al2O3/4H-SiC junction with the Al2O3 film as a thin spacer layer was found to show the ele...
This letter reports on initial investigation results on the material quality and device suitability ...
We show that "single" stacking fault 3C inclusions formed in 4H-SiC p-i-n diodes behave as...
Using ballistic electron emission microscopy (BEEM), high-temperature- processing-induced 'double-st...
Ballistic electron emission microscopy (BEEM) measurements have been performed on Pt/p-type 4H-SiC S...
SiC is a polytypic material that may crystallize in many different close-packing sequences with cubi...
Abstract: We have performed ballistic-electron emission microscopy (BEEM) of Pd and Pt Schottky con...
Ballistic electron-emission spectroscopy (BEES) and photoluminescence are used to study conduction-b...
Abstract: We report ballistic-electron emission microscopy (BEEM) investigation of Pd, Pt Schottky ...
Ballistic electron emission microscopy was used to measure the increase of local Schottky barrier (c...
The ability of cubic phase (3C-) Silicon Carbide (SiC) to grow heteroepitaxially on Silicon (Si) sub...
During the 2001-2002 award period, we performed research on Pt/Ti/bare 6H-SiC and bare 4H-SiC interf...
In this article Schottky barrier diodes comprising of a n-n germanium-silicon carbide (Ge-SiC) heter...
High-temperature-processing-induced double-stacking-fault 3C−SiC inclusions in 4H SiC were studied...
Emerging wide bandgap semiconductor devices such as the ones built with SiC have the potential to re...
The Au/Ni/Al2O3/4H-SiC junction with the Al2O3 film as a thin spacer layer was found to show the ele...
This letter reports on initial investigation results on the material quality and device suitability ...