We propose indium (In), a low work function and nitride-forming element, as an efficient ohmic contact layer to N-face n-GaN. While conventional Al-based ohmic contacts show severe degradation after annealing at 300 C, In-based ohmic contacts display considerable improvement in contact resistivity. The annealing-induced enhancement of ohmic behavior in In-based contacts is attributed to the formation of an InN interfacial layer, which is supported by x-ray photoemission spectroscopy measurements. These results suggest that In is of particular importance for application as reliable ohmic contacts to n-GaN of GaN-based vertical light-emitting diodes.open3
We report novel metallization schemes of transparent p-ohmic contacts for conventional LEDs and refl...
This paper analyzes the high temperature instabilities of ohmic contacts on p-type gallium nitride t...
Blue III-nitride light-emitting diodes (LEDs) are widely used nowadays in solid-state lighting, as w...
We propose indium (In), a low work function and nitride-forming element, as an efficient ohmic conta...
We investigated the In-based ohmic contacts on Nitrogen-face (N-face) n-type GaN, as well as Ga-face...
The effect of an indium middle layer on the structural, thermal and electrical properties of Ag cont...
We report the improved performance of InGaN/GaN-based light-emitting diodes (LEDs) through the desig...
A Ti(12 nm)W(20 nm)Au(50 nm) metallization scheme has been investigated for obtaining thermally stab...
The electrical properties of Ni-based ohmic contacts to N-face p-type GaN were investigated. The spe...
We have investigated the Ag (1 nm)indium tin oxide (ITO) (200 nm) contacts by scanning transmission ...
Wide-bandgap nitride semiconductors are currently in development for high-power electronic applicati...
Ti/Al contacts formed on n-GaN and AlGaN/GaN layers upon annealing at temperatures below the melting...
In this paper, the electrical charateristics of Ti/Al and (Ga) Ti/Al contacts to N-polar n-GaN were ...
There is an increasing demand for high-power electronic components and optoelectronic devices with l...
In recent years, the on-resistance, power loss and cell density of Si power devices have not exhibit...
We report novel metallization schemes of transparent p-ohmic contacts for conventional LEDs and refl...
This paper analyzes the high temperature instabilities of ohmic contacts on p-type gallium nitride t...
Blue III-nitride light-emitting diodes (LEDs) are widely used nowadays in solid-state lighting, as w...
We propose indium (In), a low work function and nitride-forming element, as an efficient ohmic conta...
We investigated the In-based ohmic contacts on Nitrogen-face (N-face) n-type GaN, as well as Ga-face...
The effect of an indium middle layer on the structural, thermal and electrical properties of Ag cont...
We report the improved performance of InGaN/GaN-based light-emitting diodes (LEDs) through the desig...
A Ti(12 nm)W(20 nm)Au(50 nm) metallization scheme has been investigated for obtaining thermally stab...
The electrical properties of Ni-based ohmic contacts to N-face p-type GaN were investigated. The spe...
We have investigated the Ag (1 nm)indium tin oxide (ITO) (200 nm) contacts by scanning transmission ...
Wide-bandgap nitride semiconductors are currently in development for high-power electronic applicati...
Ti/Al contacts formed on n-GaN and AlGaN/GaN layers upon annealing at temperatures below the melting...
In this paper, the electrical charateristics of Ti/Al and (Ga) Ti/Al contacts to N-polar n-GaN were ...
There is an increasing demand for high-power electronic components and optoelectronic devices with l...
In recent years, the on-resistance, power loss and cell density of Si power devices have not exhibit...
We report novel metallization schemes of transparent p-ohmic contacts for conventional LEDs and refl...
This paper analyzes the high temperature instabilities of ohmic contacts on p-type gallium nitride t...
Blue III-nitride light-emitting diodes (LEDs) are widely used nowadays in solid-state lighting, as w...