Add to ORKGThesis deals with vapor soldering and wetting the surface with solder during the soldering process. It describes in detail the advantages and disadvantages of various surface finishes on the PCB. Generally characterizes the properties of lead-free solders and fluxes. Describes vapor soldering process, including the properties of the liquid itself. It also focuses on a method of evaluating the wettability by using solder balls and its performance on individual samples surface finishes
In this article are presented results from the investigations of some peculiarities in the process o...
This work deals with the metal surface wetting problems of molten lead-free solder and monitoring of...
The purpose of this paper is to publish on the review of the lead free solder for electronic packagi...
In this paper the wetting properties of lead free solder alloys were investigated on different print...
This master´s thesis dealing with study of influence of inert atmosphere on the wettability of solde...
An investigation was conducted to assess the impact of reflow soldering inert atmosphere quality on ...
Abstract: Wettability plays an important role in the integrity of solder joints especially in critic...
This bachelor’s thesis with measuring of wetting characteristics by the wetting balance method for s...
This bachelor´s thesis deals with testing methods for surface finishe´s wettability PCB. For this te...
This master’s thesis deals with measuring and evaluation of wetting for samples of different surface...
Purpose – The purpose of this paper is to evaluate the effect of nitrogen and air atmospheres on the...
Tato bakalářská práce se zabývá vlivy povrchových úprav desek plošných spojů na pájitelnost. Teoreti...
Tato bakalářská práce se zabývá vlivy povrchových úprav desek plošných spojů na pájitelnost. Teoreti...
The article presents the results of solderability testing of printed circuit boards. The aim of this...
Surface conditions on Printed Circuit Board (PCB) final finishes have an important impact on the wet...
In this article are presented results from the investigations of some peculiarities in the process o...
This work deals with the metal surface wetting problems of molten lead-free solder and monitoring of...
The purpose of this paper is to publish on the review of the lead free solder for electronic packagi...
In this paper the wetting properties of lead free solder alloys were investigated on different print...
This master´s thesis dealing with study of influence of inert atmosphere on the wettability of solde...
An investigation was conducted to assess the impact of reflow soldering inert atmosphere quality on ...
Abstract: Wettability plays an important role in the integrity of solder joints especially in critic...
This bachelor’s thesis with measuring of wetting characteristics by the wetting balance method for s...
This bachelor´s thesis deals with testing methods for surface finishe´s wettability PCB. For this te...
This master’s thesis deals with measuring and evaluation of wetting for samples of different surface...
Purpose – The purpose of this paper is to evaluate the effect of nitrogen and air atmospheres on the...
Tato bakalářská práce se zabývá vlivy povrchových úprav desek plošných spojů na pájitelnost. Teoreti...
Tato bakalářská práce se zabývá vlivy povrchových úprav desek plošných spojů na pájitelnost. Teoreti...
The article presents the results of solderability testing of printed circuit boards. The aim of this...
Surface conditions on Printed Circuit Board (PCB) final finishes have an important impact on the wet...
In this article are presented results from the investigations of some peculiarities in the process o...
This work deals with the metal surface wetting problems of molten lead-free solder and monitoring of...
The purpose of this paper is to publish on the review of the lead free solder for electronic packagi...