A means for power electronics to exploit the level of 3-D packaging already being implemented in compact consumer products, such as digital cameras, is investigated in order to increase its power density. The increase in functionality and usage of printed circuit board (PCB) in power electronic converters is highlighted and improvements proposed to boost PCB usage to the next level. The material and manufacturing cost of an embedded planar transformer in a PCB-assembled power converter has been substantially reduced by introducing flexible-foil PCB to create the many windings without increasing the remaining number of (expensive) rigid PCB layers. Aspects such as the required folding pattern and its PCB material usage receive qualitative an...
International audienceIn this paper, we present a short overview of the power dies interconnects bas...
Rapid developments of planar magnetics in recent years have prompted new applications of planar tran...
International audienceThis paper presents an original 3D folded power inductor concept using Printed...
A means for power electronics to exploit the level of 3-D packaging already being implemented in com...
The current construction technology for PCB assembled power converters is based on the assembly of p...
The current construction technology for PCB assembled power converters is based on the assembly of p...
Current PCB power converter construction technologies are based on the utilization of nonstandardize...
The use of power electronics is growing extensively in applications such as the automotive field, li...
International audienceThe embedding of components in Printed Circuit Board (PCB) material is an attr...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
Power electronics packaging with a high level of compactness, robustness and versatility has recentl...
High integrated printed circuit boards (PCB) for high power applications needs new cooling concepts....
The use of Printed Circuit Board (PCB) technology for device packaging offers new opportunities to s...
As component and power densities have increased, printed circuit boards (PCBs) have taken on additio...
International audienceIn this paper, we present a short overview of the power dies interconnects bas...
International audienceIn this paper, we present a short overview of the power dies interconnects bas...
Rapid developments of planar magnetics in recent years have prompted new applications of planar tran...
International audienceThis paper presents an original 3D folded power inductor concept using Printed...
A means for power electronics to exploit the level of 3-D packaging already being implemented in com...
The current construction technology for PCB assembled power converters is based on the assembly of p...
The current construction technology for PCB assembled power converters is based on the assembly of p...
Current PCB power converter construction technologies are based on the utilization of nonstandardize...
The use of power electronics is growing extensively in applications such as the automotive field, li...
International audienceThe embedding of components in Printed Circuit Board (PCB) material is an attr...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
Power electronics packaging with a high level of compactness, robustness and versatility has recentl...
High integrated printed circuit boards (PCB) for high power applications needs new cooling concepts....
The use of Printed Circuit Board (PCB) technology for device packaging offers new opportunities to s...
As component and power densities have increased, printed circuit boards (PCBs) have taken on additio...
International audienceIn this paper, we present a short overview of the power dies interconnects bas...
International audienceIn this paper, we present a short overview of the power dies interconnects bas...
Rapid developments of planar magnetics in recent years have prompted new applications of planar tran...
International audienceThis paper presents an original 3D folded power inductor concept using Printed...