The manuscript shows that nano-engineering the surface of diamond particles prior contacting the liquid metal strongly enhances the Thermal Conductivity (TC) of Al/diamond composites. Composites were fabricated by gas pressure infiltration within a two-step engineering procedure: i) diamond surface was in situ subjected to gas desorption by annealing at 760 °C or 850 °C, and, ii) the contact time between liquid metal and diamond was strictly controlled. The synergic action of surface modification and controlled processing conditions allows an outstanding increasing of TC from 422 W/mK to 734 W/mK (around 42% of increment) in composites fabricated with medium-quality diamond particles.The authors acknowledge the “Ministerio de Economía y Com...
Diamond-based metal matrix composites have been made based on pure Al and eutectic Ag-3Si alloy by g...
Diamond/aluminum composite material has the advantages of high thermal conductivity, low expansion, ...
Open-pore Mg foams, which have been traditionally discarded for heat dissipation applications given ...
Diamond/metal composites are very attractive materials for electronics because their excellent therm...
In this study, Al/diamond composites were fabricated by the gas pressure infiltration method. The in...
The effects of processing conditions on the thermal conductivity (TC) of aluminum/diamond composites...
Al/diamond composites containing diamond particles of different qualities have been manufactured by ...
Realizing high-efficiency thermal management is of great significance for the fast growth of high-pe...
A new design route is proposed in order to fabricate aluminum matrix diamond-containing composite ma...
The mainstream fabrication technologies and the key factors affecting their thermal conductivity of ...
Interfacial configurations of the diamond/Al composites fabricated by vacuum hot pressing (VHP) and ...
We have successfully fabricated highly densified aluminum (Al)-diamond composite materials by a simp...
Aluminum matrix composites reinforced with diamond particles were consolidated by spark plasma sinte...
Traditional metal foams, which are incapable to meet the heat dissipation demands of today’s electro...
© 2019 Acta Materialia Inc. Aluminum-diamond composites were produced using selective laser melting...
Diamond-based metal matrix composites have been made based on pure Al and eutectic Ag-3Si alloy by g...
Diamond/aluminum composite material has the advantages of high thermal conductivity, low expansion, ...
Open-pore Mg foams, which have been traditionally discarded for heat dissipation applications given ...
Diamond/metal composites are very attractive materials for electronics because their excellent therm...
In this study, Al/diamond composites were fabricated by the gas pressure infiltration method. The in...
The effects of processing conditions on the thermal conductivity (TC) of aluminum/diamond composites...
Al/diamond composites containing diamond particles of different qualities have been manufactured by ...
Realizing high-efficiency thermal management is of great significance for the fast growth of high-pe...
A new design route is proposed in order to fabricate aluminum matrix diamond-containing composite ma...
The mainstream fabrication technologies and the key factors affecting their thermal conductivity of ...
Interfacial configurations of the diamond/Al composites fabricated by vacuum hot pressing (VHP) and ...
We have successfully fabricated highly densified aluminum (Al)-diamond composite materials by a simp...
Aluminum matrix composites reinforced with diamond particles were consolidated by spark plasma sinte...
Traditional metal foams, which are incapable to meet the heat dissipation demands of today’s electro...
© 2019 Acta Materialia Inc. Aluminum-diamond composites were produced using selective laser melting...
Diamond-based metal matrix composites have been made based on pure Al and eutectic Ag-3Si alloy by g...
Diamond/aluminum composite material has the advantages of high thermal conductivity, low expansion, ...
Open-pore Mg foams, which have been traditionally discarded for heat dissipation applications given ...