Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications

Satu nano-pes argentum-kuprum (Ag-Cu) yang dirumuskan dengan mencampurkan nanopartikel Ag dan Cu dengan penambah organik (pelekat resin, terpineol dan ethylene glycol) telah dihasilkan bagi diaplikasikan sebagai bahan lampir-dai suhu tinggi. Pelbagai peratus berat nanopartikel Cu (20-80 wt%) telah ditambahkan ke dalam nano-pes Ag-Cu, diikuti oleh pensinteran di udara terbuka pada suhu 380°C selama 30 min tanpa bantuan tekanan luar, untuk mengkaji kesan terhadap sifat-sifat fizikal, elektrikal, terma dan mekanikal. A silver-copper (Ag-Cu) nanopaste formulated by mixing Ag and Cu nanoparticles with organic additives (i.e., resin binder, terpineol and ethylene glycol) which is meant for high-temperature die-attach applications has been developed. Various weight percent of Cu nanoparticles (20-80 wt%) has been loaded into the Ag-Cu nanopaste, followed by sintering in open air at temperature of 380°C for 30 min without the need of applied external pressure