All products in the Very-Large-Scale-Integrated-Circuit (VLSIC) industry go through three major stages of production - Design, Verification and Manufacturing. Unfortunately, neither of these stages are truly perfect, hence we need two more sub-stages of manufacturing, namely Testing and Defect Diagnosis to prevent imperfections in ICs. Testing is used to generate test vectors to validate the functionality of the Device-under-Test (DUT), and Defect Diagnosis is the process of identifying the root-cause of a failing chip, i.e., the location and nature of defect. Systematic defects are unintended structural and material changes at specific locations with a higher probability of failure due to repeating manufacturing imperfections. While Design...
A theoretical framework to model spot defects with their related faults in any IC technology is pres...
This paper describes a method of developing a Defect Oriented Test (DOT) strategy by using Inductive...
With the steady increase of transistor counts and the increase of wafer sizes, design for manufactur...
All products in the Very-Large-Scale-Integrated-Circuit (VLSIC) industry go through three major stag...
The occurrence of systematic defects is increasing with shrinking feature sizes of manufacturing pro...
Fault diagnosis plays an important role in improving the circuit design process and the manufacturin...
Manufacture testing of digital integrated circuits is essential for high quality. However, exhaustiv...
It is important to check whether the manufactured circuit has physical defects or not. Else, the def...
Microelectronic systems packaging involves layout dimensions of the order of microns. During manufac...
Microelectronic systems packaging involves layout dimensions of the order of microns. During manufac...
Due to shrinking feature sizes, the number of defects in electronic chips has risen. These defects c...
This paper describes a method of developing a Defect Oriented Test (DOT) strategy by using Inductive...
A theoretical framework to model spot defects with their related faults in any IC technology is pres...
A theoretical framework to model spot defects with their related faults in any IC technology is pres...
A theoretical framework to model spot defects with their related faults in any IC technology is pres...
A theoretical framework to model spot defects with their related faults in any IC technology is pres...
This paper describes a method of developing a Defect Oriented Test (DOT) strategy by using Inductive...
With the steady increase of transistor counts and the increase of wafer sizes, design for manufactur...
All products in the Very-Large-Scale-Integrated-Circuit (VLSIC) industry go through three major stag...
The occurrence of systematic defects is increasing with shrinking feature sizes of manufacturing pro...
Fault diagnosis plays an important role in improving the circuit design process and the manufacturin...
Manufacture testing of digital integrated circuits is essential for high quality. However, exhaustiv...
It is important to check whether the manufactured circuit has physical defects or not. Else, the def...
Microelectronic systems packaging involves layout dimensions of the order of microns. During manufac...
Microelectronic systems packaging involves layout dimensions of the order of microns. During manufac...
Due to shrinking feature sizes, the number of defects in electronic chips has risen. These defects c...
This paper describes a method of developing a Defect Oriented Test (DOT) strategy by using Inductive...
A theoretical framework to model spot defects with their related faults in any IC technology is pres...
A theoretical framework to model spot defects with their related faults in any IC technology is pres...
A theoretical framework to model spot defects with their related faults in any IC technology is pres...
A theoretical framework to model spot defects with their related faults in any IC technology is pres...
This paper describes a method of developing a Defect Oriented Test (DOT) strategy by using Inductive...
With the steady increase of transistor counts and the increase of wafer sizes, design for manufactur...