The objective of this thesis is to optimize the uncore of 3D many-core architectures. More specifically, we note that technology trends point to large increases in memory-level concurrency. This in turn affects the design of the multi-core interconnect and organization of the memory hierarchy. The work addresses the need for re-optimization in the presence of this increase in concurrency of the memory system. First, we observe that 2D network latency and inefficient parallelism management in the current 3D designs are the main bottlenecks to fully exploit the potentials of 3D. To that end, we propose an extremely low-latency, low-power, high-radix router and present its various versions for different network typologies and configurations. W...
Historically, processor performance has increased at a much faster rate than that of main memory and...
International audienceShared L1 memories are of interest for tightly-coupled processor clusters in p...
International audienceWith the emergence of manycore architectures, the need of on-chip memories suc...
Memory bandwidth has become a major performance bottleneck as more and more cores are integrated ont...
Advancements in packaging technology enable high-bandwidth 3D-DRAM that mitigates the memory bandwid...
Journal Article3D die-stacked chips are emerging as intriguing prospects for the future because of ...
Continuous semiconductor technology scaling and the rapid increase in computational needs have stimu...
Resource pooling, wheremultiple architectural components are shared among cores, is a promising tech...
This article extends our prior work to show that a straightforward use of 3D stacking technology ena...
Historically, processor performance has increased at a much faster rate than that of main memory and...
Historically, processor performance has increased at a much faster rate than that of main memory and...
Thesis (Ph.D.), Electrical Engineering, Washington State UniversityAs the demand for high performanc...
This paper aims to address the issue of CPU-memory intercommunication latency with the help of 3D st...
Journal ArticleCache hierarchies in future many-core processors are expected to grow in size and co...
The main aim of this thesis is to examine the advantages of 3D stacking applied to microprocessors a...
Historically, processor performance has increased at a much faster rate than that of main memory and...
International audienceShared L1 memories are of interest for tightly-coupled processor clusters in p...
International audienceWith the emergence of manycore architectures, the need of on-chip memories suc...
Memory bandwidth has become a major performance bottleneck as more and more cores are integrated ont...
Advancements in packaging technology enable high-bandwidth 3D-DRAM that mitigates the memory bandwid...
Journal Article3D die-stacked chips are emerging as intriguing prospects for the future because of ...
Continuous semiconductor technology scaling and the rapid increase in computational needs have stimu...
Resource pooling, wheremultiple architectural components are shared among cores, is a promising tech...
This article extends our prior work to show that a straightforward use of 3D stacking technology ena...
Historically, processor performance has increased at a much faster rate than that of main memory and...
Historically, processor performance has increased at a much faster rate than that of main memory and...
Thesis (Ph.D.), Electrical Engineering, Washington State UniversityAs the demand for high performanc...
This paper aims to address the issue of CPU-memory intercommunication latency with the help of 3D st...
Journal ArticleCache hierarchies in future many-core processors are expected to grow in size and co...
The main aim of this thesis is to examine the advantages of 3D stacking applied to microprocessors a...
Historically, processor performance has increased at a much faster rate than that of main memory and...
International audienceShared L1 memories are of interest for tightly-coupled processor clusters in p...
International audienceWith the emergence of manycore architectures, the need of on-chip memories suc...