Microfluidic convection cooling is a promising technique for future high power microprocessors, radio-frequency (RF) transceivers, solid-state lasers, and light emitting diodes (LED). Three-dimensional (3D) stacking of chips is a configuration that allows many performance benefits. A microgap with circulating fluid is a promising cooling arrangement that can be incorporated within a 3D chip stack. Although studies have examined the thermal characteristics of microgaps under both single-phase and two-phase convection, the characteristics and benefits of microgaps with surface enhancement features have not been fully explored. In this work, firstly, the single phase thermal/fluid characteristics of microgaps with staggered pin fin arrays are ...
Microfluidic cooling technology is a promising thermal solution for high-performance three-dimension...
Cooling the new generation of 3D high power electronic chips is one of the leading challenges in mic...
A novel cooler utilizing thin Film Evaporation on micro-Enabled surfaces and fluid Delivery System (...
In modern microprocessors, thermal management has become one of the main hurdles in continued perfor...
The substantial increase in the transistor density of integrated circuits (ICs) in recent times has ...
This article reviews recent studies on the hydrodynamic and thermal characteristics of micro pin fin...
Interlayer cooling removes the heat dissipated by vertically stacked chips in multiple integrated fl...
The micro-pin-fins prepared on the back side of the power chip enable heat removal on the level of m...
The increased circuit density on today’s computer chips is reaching the heat dissipation limits for ...
A three-dimensional convective heat transfer model of a microchannel pin-fin hybrid heat sink was es...
Immersion cooling techniques, which provide convective and/or ebullient heat transfer, along with bu...
2.5D/3D stacking technique offers a promising solution to extend the Moore Law, meanwhile also leads...
MEMS heat sink having wavy microchannels integrating circular pin-fins for cooling of microelectroni...
The three-dimensional thermal ground plane was developed in response to the needs of high-power dens...
Using microfluidic cooling to achieve thermal management of three-dimensional integrated circuits (I...
Microfluidic cooling technology is a promising thermal solution for high-performance three-dimension...
Cooling the new generation of 3D high power electronic chips is one of the leading challenges in mic...
A novel cooler utilizing thin Film Evaporation on micro-Enabled surfaces and fluid Delivery System (...
In modern microprocessors, thermal management has become one of the main hurdles in continued perfor...
The substantial increase in the transistor density of integrated circuits (ICs) in recent times has ...
This article reviews recent studies on the hydrodynamic and thermal characteristics of micro pin fin...
Interlayer cooling removes the heat dissipated by vertically stacked chips in multiple integrated fl...
The micro-pin-fins prepared on the back side of the power chip enable heat removal on the level of m...
The increased circuit density on today’s computer chips is reaching the heat dissipation limits for ...
A three-dimensional convective heat transfer model of a microchannel pin-fin hybrid heat sink was es...
Immersion cooling techniques, which provide convective and/or ebullient heat transfer, along with bu...
2.5D/3D stacking technique offers a promising solution to extend the Moore Law, meanwhile also leads...
MEMS heat sink having wavy microchannels integrating circular pin-fins for cooling of microelectroni...
The three-dimensional thermal ground plane was developed in response to the needs of high-power dens...
Using microfluidic cooling to achieve thermal management of three-dimensional integrated circuits (I...
Microfluidic cooling technology is a promising thermal solution for high-performance three-dimension...
Cooling the new generation of 3D high power electronic chips is one of the leading challenges in mic...
A novel cooler utilizing thin Film Evaporation on micro-Enabled surfaces and fluid Delivery System (...