Broadband Dielectric Spectroscopy (BDS) has been employed to monitor the curing of two epoxy resins used for infusion based manufacturing processes. For this purpose, dielectric spectra of the resins in a frequency range from 1106 Hz have been recorded continuously during isothermal storage of samples at various curing temperatures (50, 70 and 90°C). The time dependence of fit parameters obtained from analysis of the dielectric loss eps'' according to the Havriliak-Negami (HN) function [1,2] is discussed and compared with kinetic simulations of the curing process based on measurements by differential scanning calorimetry (DSC)
The principal objective of this paper is to describe how complex impedance, obtained from frequency ...
The principal objective of this paper is to describe how complex impedance, obtained from frequency ...
The curing characteristics of diglycidyl ether of bisphenol A (DGEBA) with diaminodiphenylmethane (D...
<div><p>The final properties of thermosets are strongly dependent on their curing process. Therefore...
Dielectric analysis (DEA) is an effective method for monitoring the curing process of epoxy resin (E...
Dielectric monitoring and supporting techniques (differential Scanning calorimetry, infra-red spect...
ABSTRACT: A rapid, convenient and accurate experimental technique has been devel-oped for evaluating...
Cure protocols of thermoset resins usually comprise two isothermal steps where resins undergo molecu...
Flexible dielectric sensors received significant interest for real-time in situ cure monitoring of p...
Observing the curing reaction of epoxy resins is a key to quality assurance in fibre composite produ...
ABSTRACT: Microwave reflection resonator sensors have been developed to monitor the complex, dynamic...
Dielectric thermal analysis has been proved as a valuable tool for monitoring the epoxy curing proce...
AbstractThe continuous growth of the composites industry accompanied by the use of emerging new mate...
There is a strong demand for cure monitoring solutions to improve the manufacturing processes for F...
The interpretation and modelling of the dielectric response of thermosetting materials during cure w...
The principal objective of this paper is to describe how complex impedance, obtained from frequency ...
The principal objective of this paper is to describe how complex impedance, obtained from frequency ...
The curing characteristics of diglycidyl ether of bisphenol A (DGEBA) with diaminodiphenylmethane (D...
<div><p>The final properties of thermosets are strongly dependent on their curing process. Therefore...
Dielectric analysis (DEA) is an effective method for monitoring the curing process of epoxy resin (E...
Dielectric monitoring and supporting techniques (differential Scanning calorimetry, infra-red spect...
ABSTRACT: A rapid, convenient and accurate experimental technique has been devel-oped for evaluating...
Cure protocols of thermoset resins usually comprise two isothermal steps where resins undergo molecu...
Flexible dielectric sensors received significant interest for real-time in situ cure monitoring of p...
Observing the curing reaction of epoxy resins is a key to quality assurance in fibre composite produ...
ABSTRACT: Microwave reflection resonator sensors have been developed to monitor the complex, dynamic...
Dielectric thermal analysis has been proved as a valuable tool for monitoring the epoxy curing proce...
AbstractThe continuous growth of the composites industry accompanied by the use of emerging new mate...
There is a strong demand for cure monitoring solutions to improve the manufacturing processes for F...
The interpretation and modelling of the dielectric response of thermosetting materials during cure w...
The principal objective of this paper is to describe how complex impedance, obtained from frequency ...
The principal objective of this paper is to describe how complex impedance, obtained from frequency ...
The curing characteristics of diglycidyl ether of bisphenol A (DGEBA) with diaminodiphenylmethane (D...