Hermeticity is a measure of how well a package can maintain its intended ambient cavity environment over the device lifetime. Since many Micro-Electro-Mechanical Systems (MEMS) sensors, actuators and microelectronic devices require a known cavity environment for optimum operational performance, it is important to know the leak rate of the package for lifetime prediction purposes. In this field, limitations in the traditional leak detection methods and standards used originally for integrated circuits and semiconductors have been blindly and often incorrectly applied to MEMS and microelectronic packages. The aim of this project is to define accurately the limitations of the existing hermeticity test methods and standards when applied...
This thesis describes the development of wafer-level, low temperature thin film packages. Two packag...
The present invention is a hermetic seal leak detection apparatus, which can be used to test for her...
Hermeticity, reliability and strength of Al-Al thermocompression bonds realized by applying differen...
Hermeticity is a measure of the "leak-proof ness" of packages with internal cavities and is critical...
This chapter discusses the Hermicity Tests in detail. Hermeticity testing is a technology that deals...
MEMS (Micro Electro Mechanical Systems) are micro machines, i.e. freestanding very small devices tha...
Hermeticity is crucial for the long-term implantation of electronic packages. Pushed by advances in ...
MEMS (Micro Electro Mechanical Systems) are micro machines, i.e. freestanding very small devices tha...
Hermeticity is a measure of the “leak-proof ness ” of packages with internal cavities and is critica...
Hermetic packaging is crucial for enclosing sensitive components such as those found in implantable ...
Vacuum wafer bonding technology provides a number of very effective techniques to produce low-cost, ...
The rapid incursion of new technologies such as MEMS and smart sensor device manufacturing requires ...
Vacuum wafer bonding technology provides a number of very effective techniques to produce low-cost, ...
With the development of MEMS technology, especially the development of packaging technology, more an...
This thesis describes the development of wafer-level, low temperature thin film packages. Two packag...
This thesis describes the development of wafer-level, low temperature thin film packages. Two packag...
The present invention is a hermetic seal leak detection apparatus, which can be used to test for her...
Hermeticity, reliability and strength of Al-Al thermocompression bonds realized by applying differen...
Hermeticity is a measure of the "leak-proof ness" of packages with internal cavities and is critical...
This chapter discusses the Hermicity Tests in detail. Hermeticity testing is a technology that deals...
MEMS (Micro Electro Mechanical Systems) are micro machines, i.e. freestanding very small devices tha...
Hermeticity is crucial for the long-term implantation of electronic packages. Pushed by advances in ...
MEMS (Micro Electro Mechanical Systems) are micro machines, i.e. freestanding very small devices tha...
Hermeticity is a measure of the “leak-proof ness ” of packages with internal cavities and is critica...
Hermetic packaging is crucial for enclosing sensitive components such as those found in implantable ...
Vacuum wafer bonding technology provides a number of very effective techniques to produce low-cost, ...
The rapid incursion of new technologies such as MEMS and smart sensor device manufacturing requires ...
Vacuum wafer bonding technology provides a number of very effective techniques to produce low-cost, ...
With the development of MEMS technology, especially the development of packaging technology, more an...
This thesis describes the development of wafer-level, low temperature thin film packages. Two packag...
This thesis describes the development of wafer-level, low temperature thin film packages. Two packag...
The present invention is a hermetic seal leak detection apparatus, which can be used to test for her...
Hermeticity, reliability and strength of Al-Al thermocompression bonds realized by applying differen...