Transient liquid phase (TLP) bonding of Mg-AZ31 and Ti-6Al-4V alloys was performed using pure thin Ni electro-deposited coat interlayer (12 μm). The effect of bonding temperature, time and pressure on microstructural developments and subsequent mechanical properties across joint interface was studied at a temperature range from 500 to 540 °C, bonding time from 1 to 60 min and bonding pressure from 0 to 0.8 MPa. The mechanisms of bond formation varied across the joint region, with solid-state diffusion dominant at the Ti-6Al-4V interface and eutectic diffusion at the Mg-AZ31 interface. Joint microstructure was examined by scanning electron microscopy (SEM), and energy dispersive spectroscopy (EDS). X-ray diffraction (XRD) was used to detect ...
To develop new electronic packaging techniques for harsh environments, the microstructure and associ...
In order to address the issue for the usage of electronic systems in harsh conditions such as high t...
Microstructures and mechanical properties of Mg-9Al/Ti metallurgical bonding prepared by liquid-soli...
YesIn this research work, the transient liquid phase (TLP) bonding process was utilized to fabricate...
The joining of a Ti-6Al-4V alloy to a Mg-AZ31 alloy was performed using Ni electroplated coatings du...
Ti-6Al-4V and Mg-AZ31 were bonded together using the Transient Liquid Phase Bonding Process (TLP) af...
The transient liquid phase (TLP) bonding of Ti-6Al-4V alloy to a Mg-AZ31 alloy was performed using a...
Abstract: The transient liquid phase (TLP) bonding was used to fabricate autogenous joints in a magn...
Transient liquid phase (TLP) bonding process was applied to join magnesium alloy AZ31 samples with m...
In the present study microstructural evolution in transient liquid phase (TLP) bonded Ti3Al-Nb alloy...
AbstractTransient liquid phase (TLP) bonding process was applied to join magnesium alloy AZ31 sample...
This study demonstrates the potential of the use of Ni/Al nanolayers for joining dissimilar titanium...
NoTransient liquid phase (TLP) brazing of Mg–AZ31 alloy and Ti–6Al–4V alloy was performed using doub...
Transient liquid phase bonding (TLP) of AZ31 samples has been investigated using Cu coatings and Cu ...
The study described in this thesis deals mainly with the diffusion bonding of Ti-6Al-4V alloy to NiT...
To develop new electronic packaging techniques for harsh environments, the microstructure and associ...
In order to address the issue for the usage of electronic systems in harsh conditions such as high t...
Microstructures and mechanical properties of Mg-9Al/Ti metallurgical bonding prepared by liquid-soli...
YesIn this research work, the transient liquid phase (TLP) bonding process was utilized to fabricate...
The joining of a Ti-6Al-4V alloy to a Mg-AZ31 alloy was performed using Ni electroplated coatings du...
Ti-6Al-4V and Mg-AZ31 were bonded together using the Transient Liquid Phase Bonding Process (TLP) af...
The transient liquid phase (TLP) bonding of Ti-6Al-4V alloy to a Mg-AZ31 alloy was performed using a...
Abstract: The transient liquid phase (TLP) bonding was used to fabricate autogenous joints in a magn...
Transient liquid phase (TLP) bonding process was applied to join magnesium alloy AZ31 samples with m...
In the present study microstructural evolution in transient liquid phase (TLP) bonded Ti3Al-Nb alloy...
AbstractTransient liquid phase (TLP) bonding process was applied to join magnesium alloy AZ31 sample...
This study demonstrates the potential of the use of Ni/Al nanolayers for joining dissimilar titanium...
NoTransient liquid phase (TLP) brazing of Mg–AZ31 alloy and Ti–6Al–4V alloy was performed using doub...
Transient liquid phase bonding (TLP) of AZ31 samples has been investigated using Cu coatings and Cu ...
The study described in this thesis deals mainly with the diffusion bonding of Ti-6Al-4V alloy to NiT...
To develop new electronic packaging techniques for harsh environments, the microstructure and associ...
In order to address the issue for the usage of electronic systems in harsh conditions such as high t...
Microstructures and mechanical properties of Mg-9Al/Ti metallurgical bonding prepared by liquid-soli...