Graduation date: 2015The ever increasing requirements for heat dissipation in various thermal management applications such as computer chip cooling and high power electronics have necessitated the need for novel thermal management techniques. Thermal management using heat sinks with microscale features is amongst the prominent techniques developed over the past two decades. In this dissertation, single and phase change heat transfer and pressure drop through one such heat sink, namely microscale pin fin heat sinks (µPFHS), is examined experimentally. In particular, effects of pitch-to-diameter and aspect ratio variations are studied on the thermofluidic performance of studied µPFHSs.\ud \ud Single phase heat transfer and pressure drop of tw...
Flow behavior and heat transfer characteristics of air flow inside the plate pin fin heat sinks (PPF...
To achieve enhanced flux dissipation, microchannels heat sink are being effectively implemented in v...
Heat sinks that cool electronic systems through flow boiling are exposed to working fluids at differ...
Thesis (M.S.)--University of Hawaii at Manoa, 2007.Includes bibliographical references (leaves 74-76...
This article reviews recent studies on the hydrodynamic and thermal characteristics of micro pin fin...
In this paper, effect of gradually expanding flow passages on saturated flow boiling characteristics...
Single micro pin-fin configurations having the same chord thickness/diameter but different shapes ar...
Present paper experimentally studies combined influence of artificial nucleation sites and expanding...
Cooling the new generation of 3D high power electronic chips is one of the leading challenges in mic...
This paper numerically and experimentally investigated the liquid cooling efficiency of heat sinks c...
Flow boiling in micro-pin fn structured heat sinks is an up-to-date thermal management technique. Ho...
A combined experimental and computational fluid dynamics (CFD) study of single-phase liquid nitrogen...
In the present work fluid flow and heat transfer characteristics of a micro pin fin heat sink were i...
Flow boiling in heat sinks has been rigorously exploited in the heat transfer community to achieve h...
This paper presents the experimental results of laminar flow behavior of water in circular micro pin...
Flow behavior and heat transfer characteristics of air flow inside the plate pin fin heat sinks (PPF...
To achieve enhanced flux dissipation, microchannels heat sink are being effectively implemented in v...
Heat sinks that cool electronic systems through flow boiling are exposed to working fluids at differ...
Thesis (M.S.)--University of Hawaii at Manoa, 2007.Includes bibliographical references (leaves 74-76...
This article reviews recent studies on the hydrodynamic and thermal characteristics of micro pin fin...
In this paper, effect of gradually expanding flow passages on saturated flow boiling characteristics...
Single micro pin-fin configurations having the same chord thickness/diameter but different shapes ar...
Present paper experimentally studies combined influence of artificial nucleation sites and expanding...
Cooling the new generation of 3D high power electronic chips is one of the leading challenges in mic...
This paper numerically and experimentally investigated the liquid cooling efficiency of heat sinks c...
Flow boiling in micro-pin fn structured heat sinks is an up-to-date thermal management technique. Ho...
A combined experimental and computational fluid dynamics (CFD) study of single-phase liquid nitrogen...
In the present work fluid flow and heat transfer characteristics of a micro pin fin heat sink were i...
Flow boiling in heat sinks has been rigorously exploited in the heat transfer community to achieve h...
This paper presents the experimental results of laminar flow behavior of water in circular micro pin...
Flow behavior and heat transfer characteristics of air flow inside the plate pin fin heat sinks (PPF...
To achieve enhanced flux dissipation, microchannels heat sink are being effectively implemented in v...
Heat sinks that cool electronic systems through flow boiling are exposed to working fluids at differ...