Add to ORKGA mathematical model for chemical-mechanical polishing is developed. The effects of pad bending, fluid flow, and friction are considered. Fluid flow and friction effects are determined to be insignificant in the current model. Numerical results for the model including pad bending are presented and compared to experimental data
High precision optical components are required for modern life and future. To achieve component’s su...
Chemical-Mechanical Polishing (CMP) is an essential process in the manufacturing of micropro-cessors...
[[abstract]]An analytic model of the material removal rate is proposed for chemical mechanical plana...
In this paper, a physical model for the development of dishing during metal chemical mechanical poli...
Fixed abrasive chemical mechanical polishing has some advantages in generating planarity surfaces of...
It is well known that the chemical reaction between an oxide layer and a water-based slurry produces...
Abstract—This paper presents the experimental validation and some application examples of the propos...
Due to copyright restrictions, the access to the full text of this article is only available via sub...
\u3cp\u3eIn this paper, a physical model for the development of dishing during metal chemical mechan...
The simulation of chemical-mechanical polishing (CMP) is particularly important within integrated to...
The Chemical Mechanical polishing (CMP) process is now widely employed in the Integrated Circuit Fab...
Statistical models are presented to describe the evolution of the surface roughness of polishing pad...
With the development of integrated circuit technology, especially after entering the sub-micron proc...
Chemical-Mechanical Polishing (CMP) is an essential process in the manufacturing of micropro-cessors...
Surface polishing is a typical example of a machining process based on mixed chemical-mechanical phe...
High precision optical components are required for modern life and future. To achieve component’s su...
Chemical-Mechanical Polishing (CMP) is an essential process in the manufacturing of micropro-cessors...
[[abstract]]An analytic model of the material removal rate is proposed for chemical mechanical plana...
In this paper, a physical model for the development of dishing during metal chemical mechanical poli...
Fixed abrasive chemical mechanical polishing has some advantages in generating planarity surfaces of...
It is well known that the chemical reaction between an oxide layer and a water-based slurry produces...
Abstract—This paper presents the experimental validation and some application examples of the propos...
Due to copyright restrictions, the access to the full text of this article is only available via sub...
\u3cp\u3eIn this paper, a physical model for the development of dishing during metal chemical mechan...
The simulation of chemical-mechanical polishing (CMP) is particularly important within integrated to...
The Chemical Mechanical polishing (CMP) process is now widely employed in the Integrated Circuit Fab...
Statistical models are presented to describe the evolution of the surface roughness of polishing pad...
With the development of integrated circuit technology, especially after entering the sub-micron proc...
Chemical-Mechanical Polishing (CMP) is an essential process in the manufacturing of micropro-cessors...
Surface polishing is a typical example of a machining process based on mixed chemical-mechanical phe...
High precision optical components are required for modern life and future. To achieve component’s su...
Chemical-Mechanical Polishing (CMP) is an essential process in the manufacturing of micropro-cessors...
[[abstract]]An analytic model of the material removal rate is proposed for chemical mechanical plana...