Monolithically integrated SOA-MZI array in InP/InGaAsP, suited for flip-chip packaging

An array of integrated all-optical SOA-Mach-Zehnder switches is demonstrated. The alloptical switches consist of MZIs with SOAs in the arms. For packaging a number of additional features are implemented: Spotsize converters are integrated to achieve a good overlap with cleaved fibers. For vertical alignment of the chips in the package, recesses are etched till a well defined level. For sub-micron horizontal alignment, cleave openings are lithographically defined and deeply wet-etched. First tests on chips packaged P-sideup, show large static extinction ratios (ER) and switching up to 40 Gb/s with an ER of more than 9 dB