Interfacial delamination is a key reliability challenge in composites and micro-electronic systems due to (high density) integration of dissimilar materials. Predictive finite element models are used during the design and optimization stage to minimize delamination failures, however, they requires a relevant interface model to capture the (irreversible) crack initiation and propagation behavior observed in experiments. Therefore, a set of experimentalnumerical tools is presented to enable accurate characterization of delamination mechanism(s) and prediction of the interface mechanics
Interfacial delamination has become one of the key reliability issues in the microelectronic industr...
Interfacial delamination IS one of the most important reliability issues in the microelectronic indu...
An effective interface element technology has been developed for connecting and simulating crack gro...
Interfacial delamination is a key reliability challenge in composites and microelectronic systems du...
Interfacial delamination is a key reliability challenge in composites and micro-electronic systems d...
Interfacial delamination is a key reliability challenge in composites and micro-electronic systems d...
Prevention of delamination failures by improved design calls for accurate characterization and predi...
International audienceBackground: The prediction of the behavior of laminated composite structures u...
Delamination in composite structures is best modelled at a mesoscopic level. In this approach, the p...
Interfacial delamination has been a major reliability issue for both BEoL and packaging systems. The...
Due to the fact that microelectronics is made up from various materials with highly dissimilar therm...
An in-situ experimental-numerical approach for interface delamination characterization This research...
Adhesion and delamination have been pervasive problems hampering the performance and reliability of ...
Currently, prediction of interface strength is typically done using the critical energy release rate...
Interfacial delamination, due to the presence of dissimilar material systems, is one of the primary ...
Interfacial delamination has become one of the key reliability issues in the microelectronic industr...
Interfacial delamination IS one of the most important reliability issues in the microelectronic indu...
An effective interface element technology has been developed for connecting and simulating crack gro...
Interfacial delamination is a key reliability challenge in composites and microelectronic systems du...
Interfacial delamination is a key reliability challenge in composites and micro-electronic systems d...
Interfacial delamination is a key reliability challenge in composites and micro-electronic systems d...
Prevention of delamination failures by improved design calls for accurate characterization and predi...
International audienceBackground: The prediction of the behavior of laminated composite structures u...
Delamination in composite structures is best modelled at a mesoscopic level. In this approach, the p...
Interfacial delamination has been a major reliability issue for both BEoL and packaging systems. The...
Due to the fact that microelectronics is made up from various materials with highly dissimilar therm...
An in-situ experimental-numerical approach for interface delamination characterization This research...
Adhesion and delamination have been pervasive problems hampering the performance and reliability of ...
Currently, prediction of interface strength is typically done using the critical energy release rate...
Interfacial delamination, due to the presence of dissimilar material systems, is one of the primary ...
Interfacial delamination has become one of the key reliability issues in the microelectronic industr...
Interfacial delamination IS one of the most important reliability issues in the microelectronic indu...
An effective interface element technology has been developed for connecting and simulating crack gro...