This paper proposes a framework for (signal) interconnect power optimization at the global routing stage. In a typical design flow, the primary objective of global routing is minimization of wire-length and via consumption. Our framework takes a global routing solution that is optimized for this objective, and quickly generates a new solution that is optimized for signal power, with only a small, controlled degradation in wirelength. Our model of signal power includes layer-dependent fringe and area capacitances of the routes, and their spacing. Our framework is fast compared to the existing global routing procedures, thereby not causing much overhead and fitting well in the design flow to optimize signal power after wire-length minimizatio...
Thesis: S.M., Massachusetts Institute of Technology, Sloan School of Management, Operations Research...
Global routing in VLSI (very large scale integration) design is one of the most challenging discrete...
As semiconductor technology advances in the ultra deep sub -micron era, on-chip global interconnecti...
Copyright © 2013 Tai-Hsuan Wu et al. This is an open access article distributed under the Creative C...
We consider the problem of determining optimal wire widths for a power or ground network, subject to...
This paper presents a collaborative procedure for multiobjective global routing. Our procedure takes...
In this paper, we study the interconnect layout optimization problem under a higher order resistance...
Abstract—This paper addresses the critical problem of global wire optimization for nanometer scale v...
Recent technology advent makes the efficient on-chip interconnection architecture critical in modern...
Abstract—We present an early-stage global wire-design method-ology that simultaneously considers the...
Conventional physical design flow separates the de-sign of power network and signal network. Such a ...
With the exponential reduction in the scaling of feature size, inter-wire coupling capacitance becom...
Most existing performance-driven and clock routing algorithms construct optimal routing topology for...
We propose a technique to reduce the effective parasitic capaci-tance of interconnect routing conduc...
Conventional physical design flow separates the design of power network and signal network. Such a s...
Thesis: S.M., Massachusetts Institute of Technology, Sloan School of Management, Operations Research...
Global routing in VLSI (very large scale integration) design is one of the most challenging discrete...
As semiconductor technology advances in the ultra deep sub -micron era, on-chip global interconnecti...
Copyright © 2013 Tai-Hsuan Wu et al. This is an open access article distributed under the Creative C...
We consider the problem of determining optimal wire widths for a power or ground network, subject to...
This paper presents a collaborative procedure for multiobjective global routing. Our procedure takes...
In this paper, we study the interconnect layout optimization problem under a higher order resistance...
Abstract—This paper addresses the critical problem of global wire optimization for nanometer scale v...
Recent technology advent makes the efficient on-chip interconnection architecture critical in modern...
Abstract—We present an early-stage global wire-design method-ology that simultaneously considers the...
Conventional physical design flow separates the de-sign of power network and signal network. Such a ...
With the exponential reduction in the scaling of feature size, inter-wire coupling capacitance becom...
Most existing performance-driven and clock routing algorithms construct optimal routing topology for...
We propose a technique to reduce the effective parasitic capaci-tance of interconnect routing conduc...
Conventional physical design flow separates the design of power network and signal network. Such a s...
Thesis: S.M., Massachusetts Institute of Technology, Sloan School of Management, Operations Research...
Global routing in VLSI (very large scale integration) design is one of the most challenging discrete...
As semiconductor technology advances in the ultra deep sub -micron era, on-chip global interconnecti...