Thermal interface material (TIM) is a critical component in thermal management of high density packaging systems since both the reliability and lifetime of microsystems are dependent on how the heat is dissipated. Carbon nanotubes (CNTs) are promising candidate for development of TIMs due to their excellent thermal and mechanical properties. The thermal conductivity of CNTs can be up to 3000 W/mK in the longitudinal direction which acts as ideal heat transfer path. However, the huge interfacial thermal resistance between CNTs and contact surface hinders the exploitation of CNTs as TIMs. In this paper, we will focus on the growth of CNTs on various substrates and underlayers and analyze the interaction between catalyst and underlayer materia...
International audienceWith progress in microelectronics the component density on a device increases ...
The under-hood automotive ambient is harsh and its impact on electronics used in electronic control ...
International audienceWith progress in microelectronics the component density on a device increases ...
Thermal interface material (TIM) is a critical component in thermal management of high density packa...
The development of thermal interface materials (TIMs) is necessitated by the temperature drop across...
Improvements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages...
The power density of electronic packages has substantially increased. The thermal interface resistan...
The development of integrated circuitry has resulted in cheaper and more efficient computers being a...
The development of integrated circuitry has resulted in cheaper and more efficient computers being a...
The next generation of thermal interface materials (TIMs) are currently being developed to meet the ...
The under-hood automotive ambient is harsh and its impact on electronics used in electronic control ...
International audienceWith progress in microelectronics the component density on a device increases ...
The next generation of thermal interface materials (TIMs) are currently being developed to meet the ...
With progress in microelectronics the component density on a device increases drastically. As a cons...
With progress in microelectronics the component density on a device increases drastically. As a cons...
International audienceWith progress in microelectronics the component density on a device increases ...
The under-hood automotive ambient is harsh and its impact on electronics used in electronic control ...
International audienceWith progress in microelectronics the component density on a device increases ...
Thermal interface material (TIM) is a critical component in thermal management of high density packa...
The development of thermal interface materials (TIMs) is necessitated by the temperature drop across...
Improvements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages...
The power density of electronic packages has substantially increased. The thermal interface resistan...
The development of integrated circuitry has resulted in cheaper and more efficient computers being a...
The development of integrated circuitry has resulted in cheaper and more efficient computers being a...
The next generation of thermal interface materials (TIMs) are currently being developed to meet the ...
The under-hood automotive ambient is harsh and its impact on electronics used in electronic control ...
International audienceWith progress in microelectronics the component density on a device increases ...
The next generation of thermal interface materials (TIMs) are currently being developed to meet the ...
With progress in microelectronics the component density on a device increases drastically. As a cons...
With progress in microelectronics the component density on a device increases drastically. As a cons...
International audienceWith progress in microelectronics the component density on a device increases ...
The under-hood automotive ambient is harsh and its impact on electronics used in electronic control ...
International audienceWith progress in microelectronics the component density on a device increases ...