Numerical thermal-fluid analysis of a liquid cooled novel 3-D electronic package

The need for smaller and more powerful processors has become more and more important in recent times. This need is nowhere more evident than in the military where the ability to process large amounts of data quickly and accurately can save lives. So the University of Arkansas has been researching a new chip design, the 3-D stack-up thru-silicon via chip. This has several benefits over the traditional chip designs, but comes at the price of having more heat to be dissipated. Due to the need to dissipate up to 20 watts per wafer a liquid cooling system was used with C8F18. This project was to cover this topic by modeling the fluid-thermal characteristics for both a 1 mm x 1 mm chip and a 1 cm x 1 cm chip using software provided. The different models were examined, though the 1 cm x 1 cm was not able to be examined as thoroughly as wanted due to the computers available unable to handle the models. There were also certain standards that the chip was expected to be able to perform at, but for the scenarios examined the chip was not able to perform as wanted for the scenario modeled