Corrosion rates of copper single crystal faces are determined in stirred 0·1N sulphuric acid with various chloride ion concentrations. A mechanism is proposed to explain the variation of corrosion rate with Cl− ion concentration. Up to 7·5 × 10−3M Cl− ions, the stabilities of the crystal faces are in the order (111)>(100)>(110) but this order is changed to (110)>(100)>(111) in presence of 10−2M Cl− ions. The corrosion potentials of the crystal faces are less noble at all concentrations of Cl− ions and Cl− ion acts as a cathodic inhibitor. There is no significant orientation effect on the kinetics of dissolution of copper
Effects of electrolyte solution (i.e., KOH, NaOH, NaCl, and HCl) with various concentrations (from 0...
Koroziono ponašanje bakra u ovom radu ispitivano je u alkalnoj sulfatnoj sredini u prisustvu potenc...
In this paper, the effect of the cupric and chloride ions concentrations on copper dissolution from ...
The rates of dissolution of copper single crystal planes in dilute sulphuric acid containing various...
Dissoln. rates of Cu single crystals in 0.1N H2SO4 contg. 1 × 10-8 M Cl-, Br-, or I-, were detd....
The rates of dissolution of copper single crystal (100), (110) and (111) planes in 0.1 M H2SO4 conta...
The influence of chloride on the kinetics and morphology of copper electrodeposition on copper singl...
The rates of dissoln. of Cu single crystal (100), (110), and (111) planes in 0.1 M H2SO4 contg. 10...
Weight loss and polarization techniques have been used to investigate the rates of dissolution of co...
Observations of copper electrodeposits on to the (100) plane of copper was made from highly purified...
The presence of small quantities of sulfanilamide in a highly purified acidic CuSO4 electroplating b...
The kinetics of the dissolution of copper single crystals (100), (110) and (111) planes in 0.1 M H2S...
The corrosion rates of copper single crystal 100, 110, and 111 planes have been determined in stirre...
The corrosion behavior of copper and carbon steel in 1M concentration of hydrochloric acid (HCl) and...
[[abstract]]c2002 Springer - The dissolution of copper in monoethanolamine (MEA)-complexed cupric io...
Effects of electrolyte solution (i.e., KOH, NaOH, NaCl, and HCl) with various concentrations (from 0...
Koroziono ponašanje bakra u ovom radu ispitivano je u alkalnoj sulfatnoj sredini u prisustvu potenc...
In this paper, the effect of the cupric and chloride ions concentrations on copper dissolution from ...
The rates of dissolution of copper single crystal planes in dilute sulphuric acid containing various...
Dissoln. rates of Cu single crystals in 0.1N H2SO4 contg. 1 × 10-8 M Cl-, Br-, or I-, were detd....
The rates of dissolution of copper single crystal (100), (110) and (111) planes in 0.1 M H2SO4 conta...
The influence of chloride on the kinetics and morphology of copper electrodeposition on copper singl...
The rates of dissoln. of Cu single crystal (100), (110), and (111) planes in 0.1 M H2SO4 contg. 10...
Weight loss and polarization techniques have been used to investigate the rates of dissolution of co...
Observations of copper electrodeposits on to the (100) plane of copper was made from highly purified...
The presence of small quantities of sulfanilamide in a highly purified acidic CuSO4 electroplating b...
The kinetics of the dissolution of copper single crystals (100), (110) and (111) planes in 0.1 M H2S...
The corrosion rates of copper single crystal 100, 110, and 111 planes have been determined in stirre...
The corrosion behavior of copper and carbon steel in 1M concentration of hydrochloric acid (HCl) and...
[[abstract]]c2002 Springer - The dissolution of copper in monoethanolamine (MEA)-complexed cupric io...
Effects of electrolyte solution (i.e., KOH, NaOH, NaCl, and HCl) with various concentrations (from 0...
Koroziono ponašanje bakra u ovom radu ispitivano je u alkalnoj sulfatnoj sredini u prisustvu potenc...
In this paper, the effect of the cupric and chloride ions concentrations on copper dissolution from ...