A GaN vertical light emitting diode(LED) with a current block layer(CBL) was investigated. Vertical LEDs without a CBL, with a non-ohmic contact CBL and with a silicon dioxide CBL were fabricated. Optical and electrical tests were carried out. The results show that the light output power of vertical LEDs with a non-ohmic contact CBL and with a silicon dioxide CBL are40.6% and60.7% higher than that of vertical LEDs without a CBL at350 mA, respectively. The efficiencies of vertical LEDs without a CBL, with a non-ohmic contact CBL and with a silicon dioxide CBL drop to72%,78% and85.5% of their maximum efficiency at350 mA, respectively. Moreover, vertical LEDs with a non-ohmic contact CBL have relatively superior anti-electrostatic ability.?201...
The nonpolar m-plane (1 (1) over bar 00) thin film GaN and InGaN/GaN light-emitting diodes (LEDs) gr...
We investigated the In-based ohmic contacts on Nitrogen-face (N-face) n-type GaN, as well as Ga-face...
Silicon-based power devices are reaching their fundamental performance limit. The use of wide-bandga...
Abstract—This study analyzes the current spreading effect and light extraction efficiency (LEE) of l...
Low resistance and thermally stable n-type contacts to N-polar GaN are essentially important for ver...
The effect of an indium middle layer on the structural, thermal and electrical properties of Ag cont...
Vertical-type high-voltage light-emitting diodes (HV-LEDs) with 2 × 2 micro-cells were fabricated on...
Ni substrates were electrochemically deposited on p-GaN side of vertical structure GaN-based light e...
The design and the preparation of GaN-based high-voltage DC light emitting diode are realized. It is...
Abstract—We report a fabrication and demonstration of a GaN-based high-Q vertical-cavity light-emitt...
GaN-based thin film vertical structure light-emitting diodes (VS-LEDs) were fabricated by a modified...
Uniform spreading of injection current in light-emitting diodes (LEDs) is one of the crucial require...
Most blue light LED chips are made by growing GaN epitaxy on a sapphire substrate. Because sapphire ...
Abstract—This paper reviews our recent progress of GaN-based high brightness light-emitting diodes (...
GaN-based light-emitting devices (LEDs) with different electron blocking layers are theoretically st...
The nonpolar m-plane (1 (1) over bar 00) thin film GaN and InGaN/GaN light-emitting diodes (LEDs) gr...
We investigated the In-based ohmic contacts on Nitrogen-face (N-face) n-type GaN, as well as Ga-face...
Silicon-based power devices are reaching their fundamental performance limit. The use of wide-bandga...
Abstract—This study analyzes the current spreading effect and light extraction efficiency (LEE) of l...
Low resistance and thermally stable n-type contacts to N-polar GaN are essentially important for ver...
The effect of an indium middle layer on the structural, thermal and electrical properties of Ag cont...
Vertical-type high-voltage light-emitting diodes (HV-LEDs) with 2 × 2 micro-cells were fabricated on...
Ni substrates were electrochemically deposited on p-GaN side of vertical structure GaN-based light e...
The design and the preparation of GaN-based high-voltage DC light emitting diode are realized. It is...
Abstract—We report a fabrication and demonstration of a GaN-based high-Q vertical-cavity light-emitt...
GaN-based thin film vertical structure light-emitting diodes (VS-LEDs) were fabricated by a modified...
Uniform spreading of injection current in light-emitting diodes (LEDs) is one of the crucial require...
Most blue light LED chips are made by growing GaN epitaxy on a sapphire substrate. Because sapphire ...
Abstract—This paper reviews our recent progress of GaN-based high brightness light-emitting diodes (...
GaN-based light-emitting devices (LEDs) with different electron blocking layers are theoretically st...
The nonpolar m-plane (1 (1) over bar 00) thin film GaN and InGaN/GaN light-emitting diodes (LEDs) gr...
We investigated the In-based ohmic contacts on Nitrogen-face (N-face) n-type GaN, as well as Ga-face...
Silicon-based power devices are reaching their fundamental performance limit. The use of wide-bandga...