As technology scales down, coupling between nodes of the circuits increases and becomes an important factor in interconnection analysis. In many cases like the deep submicron technology (DSM), the coupling between lines (inter-wire capacitance) is strong and the energy consumption caused by parasitic capacitance is non-negligible. In this work, we employ the differential low-weight encoding [1] to reduce energy and delay (transmission cost) on DSM buses. We propose an enumeration method that reduces the encoder table-size from O(2n) words to O(n) words, for an n-bit DSM bus, and so reduces the memory complexity significantly and facilitates energy and delay reduction due to addressing and fetching data from large lookup tables. We modify th...
Serial buses are ubiquitous interconnections in embedded computing systems that are used to interfac...
Journal ArticleThe paper presents a preliminary evaluation of novel techniques that address a growi...
Capacitive crosstalk between adjacent wires in long on-chip buses significantly increases propagatio...
As technology scales down, coupling between nodes of the circuits increases and becomes an important...
As technology scales down, coupling between nodes of the circuits increases and becomes an important...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
Interconnect analysis and optimization at high levels of abstraction is extremely attractive since i...
Continuous technology scaling sharply reduces transistor delays, while fixed-length global wire dela...
With shrinking feature size and growing integration density in the Deep Sub- Micron (DSM) technologi...
Now a day’s VLSI has become the backbone of all types of designs. Interconnect plays an increasing r...
This book provides practical solutions for delay and power reduction for on-chip interconnects and b...
Abstract — In deep-submicron (DSM) technology, minimizing power consumption of a bus is one of the m...
AbstractEnergy dissipation of interconnects is becoming a bottle neck for high performance integrate...
Interconnects on deep submicron (DSM) buses incur significantly larger power dissipation, delay perf...
Serial buses are ubiquitous interconnections in embedded computing systems that are used to interfac...
Journal ArticleThe paper presents a preliminary evaluation of novel techniques that address a growi...
Capacitive crosstalk between adjacent wires in long on-chip buses significantly increases propagatio...
As technology scales down, coupling between nodes of the circuits increases and becomes an important...
As technology scales down, coupling between nodes of the circuits increases and becomes an important...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
Interconnect analysis and optimization at high levels of abstraction is extremely attractive since i...
Continuous technology scaling sharply reduces transistor delays, while fixed-length global wire dela...
With shrinking feature size and growing integration density in the Deep Sub- Micron (DSM) technologi...
Now a day’s VLSI has become the backbone of all types of designs. Interconnect plays an increasing r...
This book provides practical solutions for delay and power reduction for on-chip interconnects and b...
Abstract — In deep-submicron (DSM) technology, minimizing power consumption of a bus is one of the m...
AbstractEnergy dissipation of interconnects is becoming a bottle neck for high performance integrate...
Interconnects on deep submicron (DSM) buses incur significantly larger power dissipation, delay perf...
Serial buses are ubiquitous interconnections in embedded computing systems that are used to interfac...
Journal ArticleThe paper presents a preliminary evaluation of novel techniques that address a growi...
Capacitive crosstalk between adjacent wires in long on-chip buses significantly increases propagatio...