The SEMATECH Berkeley Actinic Inspection Tool (AIT) is an EUV-wavelength mask inspection microscope designed for direct aerial image measurements, and pre-commercial EUV mask research. Operating on a synchrotron bending magnet beamline, the AIT uses an off-axis Fresnel zoneplate lens to project a high-magnification EUV image directly onto a CCD camera. We present the results of recent system upgrades that have improved the imaging resolution, illumination uniformity, and partial coherence. Benchmarking tests show image contrast above 75% for 100-nm mask features, and significant improvements and across the full range of measured sizes. The zoneplate lens has been replaced by an array of user-selectable zoneplates with higher magnification a...
Semiconductor devices are the building blocks of our digital infrastructure. Their main manufacturin...
ABSTRACT Aerial images for isolated defects and the interactions of defects with features are compar...
In next-generation EUV imaging for foundry N5 dimensions and beyond, inherent pitch- and orientation...
The SEMATECH Berkeley Actinic Inspection Tool (AIT) is an EUV-wavelength mask inspection microscope ...
Operating at EUV wavelengths, the SEMATECH Berkeley Actinic Inspection Tool (AIT) is a zoneplate mic...
The SEMATECH Berkeley Actinic Inspection Tool (AIT) is a dual-mode, scanning and imaging extreme-ult...
Aerial image measurement plays a key role in the development of patterned reticles for each generati...
The effort to produce defect-free mask blanks for EUV lithography relies on increasing the detection...
Extreme ultraviolet (EUV) microscopy is an important tool for the investigation of the performance o...
The SEMATECH Berkeley Actinic Inspection Tool (AIT) is a prototype EUV-wavelength zoneplate microsco...
The production of defect-free mask blanks remains a key challenge for extreme ultraviolet (EUV) lith...
This dissertation focuses on issues related to extreme ultraviolet (EUV) lithography masktechnology:...
This article is about the Actinic Inspection of Extreme Ultraviolet (EUV) lithography Programmed Mul...
The high volume inspection equipment currently available to support development of EUV blanks is non...
There is a strong demand for stand alone actinic tools for high volume manufacturing of EUV mask inf...
Semiconductor devices are the building blocks of our digital infrastructure. Their main manufacturin...
ABSTRACT Aerial images for isolated defects and the interactions of defects with features are compar...
In next-generation EUV imaging for foundry N5 dimensions and beyond, inherent pitch- and orientation...
The SEMATECH Berkeley Actinic Inspection Tool (AIT) is an EUV-wavelength mask inspection microscope ...
Operating at EUV wavelengths, the SEMATECH Berkeley Actinic Inspection Tool (AIT) is a zoneplate mic...
The SEMATECH Berkeley Actinic Inspection Tool (AIT) is a dual-mode, scanning and imaging extreme-ult...
Aerial image measurement plays a key role in the development of patterned reticles for each generati...
The effort to produce defect-free mask blanks for EUV lithography relies on increasing the detection...
Extreme ultraviolet (EUV) microscopy is an important tool for the investigation of the performance o...
The SEMATECH Berkeley Actinic Inspection Tool (AIT) is a prototype EUV-wavelength zoneplate microsco...
The production of defect-free mask blanks remains a key challenge for extreme ultraviolet (EUV) lith...
This dissertation focuses on issues related to extreme ultraviolet (EUV) lithography masktechnology:...
This article is about the Actinic Inspection of Extreme Ultraviolet (EUV) lithography Programmed Mul...
The high volume inspection equipment currently available to support development of EUV blanks is non...
There is a strong demand for stand alone actinic tools for high volume manufacturing of EUV mask inf...
Semiconductor devices are the building blocks of our digital infrastructure. Their main manufacturin...
ABSTRACT Aerial images for isolated defects and the interactions of defects with features are compar...
In next-generation EUV imaging for foundry N5 dimensions and beyond, inherent pitch- and orientation...