Uniform, High Efficiency, Hybrid CIGS Process with Application to Novel Device Structures: Annual Technical Report, 15 March 2005 - 14 March 2006

One of the main Phase I objectives of this subcontract was for EPV to demonstrate 14%-efficient CIGS devices using a hybrid process. The processing was also required to have good control ability. These goals were successfully accomplished. It will be seen that during Phase I, we successfully developed a new, simplified hybrid process. A highlight of intensive work was the achievement of a 14.0% NREL-verified device at a CIGS thickness of 1.13 ..mu..m. The simplified hybrid process considerably reduces CIGS film formation time and offers the promise of being a truly cost-effective and manufacturable one. It is considered to be one of the more attractive CIGS processes in the industry