Thermal Stability and Mechanical Behavior of Ultra-Fine Bcc Ta and v Coatings

Ultra-refined microstructures of both tantalum (Ta) and vanadium (V) are produced using electron-beam evaporation and magnetron sputtering deposition. The thermal stability of the micron-to-submicron grain size foils is examined to quantify the kinetics and activation energy of diffusion, as well as identify the temperature transition in dominant mechanism from grain boundary to lattice diffusion. The activation energies for boundary diffusion in Ta and V determined from grain growth are 0.3 and 0.2 eV{center_dot}atom{sup -1}, respectively, versus lattice diffusion values of 4.3 and 3.2 eV{center_dot}atom{sup -1}, respectively. The mechanical behavior, as characterized by strength and hardness, is found to inversely scale with square-root grain size according to the Hall-Petch relationship. The strength of Ta and V increases two-fold from 400 MPa, as the grain size decreases from 2 to 0.75 {micro}m