Conformal Deep Trench Coating with both Conducting and InsulatingMaterials

A thin film coating system has been developed for deposition of both conductive and insulating material. The system employs an RF discharge plasma source with four straight RF antennas, which is made of or covered with the deposition material, thus serving simultaneously as a sputtering target. The average deposition rate of the copper thin film can be as high as 500 nm/min when operated in CW mode. Film properties under different plasma conditions have been investigated experimentally. By adjusting RF power, gas pressure, duty factor, and substrate biasing conditions, several thin film coating schemes can be achieved, one of which has been demonstrated to be suitable for conformal deep trench coating. Conformal coating over trenches of high aspect ratio (>6:1) has been demonstrated at both micron and submicron scales