The process parameters of current density, pulse duration, and cell potential affect both the structure and composition of electrodeposits. The mechanism for nucleation and growth as determined from current transients yield relationships for nucleus density and nucleation rate. To develop an understanding of the role of the process parameters on grain size, as a design structural parameter to control strength for example, a formulation is presented to model the affects of the deposition energy on grain size and morphology. An activation energy for the deposition process is modeled that reveals different growth mechanisms, wherein nucleation and diffusion effects are each dominant as dependent upon pulse duration. A diffusion coefficient com...
There have been increasing evidences that the presence of nano-crystalline structure in bulk materia...
A full diffusion kinetic Monte Carlo algorithm is used to model nanocrystalline film deposition, and...
In the present work, the gold-nanoplating technique is used to monitor differences in the electroche...
The processing-structure-property relationship is investigated for electrodeposited foils of the gol...
The kinetics of electrocrystallization of nanostructured gold is investigated and the physical prope...
A rational understanding of what occurs during electrocrystallization, defined at a nanolevel, is de...
The effect of Cu dissolution during pulse electrodeposition process on the generation of high densit...
Interconnection with single crystal could be attractive for more reliable, predictable and multifunc...
A two-dimensional cross-sectional poly-lattice kinetic Monte Carlo (2DCSP-KMC) model has been develo...
A two-dimensional cross-sectional poly-lattice kinetic Monte Carlo (2DCSP-KMC) model has been develo...
Copper films with high density of twin boundaries are known for high mechanical strength with little...
two-dimensional cross-sectional poly-lattice kinetic Monte Carlo (2DCSP-KMC) model has been develope...
A two-dimensional cross-sectional kinetic Monte Carlo (2DCS-KMC) model has been developed to simulat...
There have been increasing evidences that the presence of nano-crystalline structure in bulk materia...
A full diffusion kinetic Monte Carlo algorithm is used to model nanocrystalline film deposition, and...
In the present work, the gold-nanoplating technique is used to monitor differences in the electroche...
The processing-structure-property relationship is investigated for electrodeposited foils of the gol...
The kinetics of electrocrystallization of nanostructured gold is investigated and the physical prope...
A rational understanding of what occurs during electrocrystallization, defined at a nanolevel, is de...
The effect of Cu dissolution during pulse electrodeposition process on the generation of high densit...
Interconnection with single crystal could be attractive for more reliable, predictable and multifunc...
A two-dimensional cross-sectional poly-lattice kinetic Monte Carlo (2DCSP-KMC) model has been develo...
A two-dimensional cross-sectional poly-lattice kinetic Monte Carlo (2DCSP-KMC) model has been develo...
Copper films with high density of twin boundaries are known for high mechanical strength with little...
two-dimensional cross-sectional poly-lattice kinetic Monte Carlo (2DCSP-KMC) model has been develope...
A two-dimensional cross-sectional kinetic Monte Carlo (2DCS-KMC) model has been developed to simulat...
There have been increasing evidences that the presence of nano-crystalline structure in bulk materia...
A full diffusion kinetic Monte Carlo algorithm is used to model nanocrystalline film deposition, and...
In the present work, the gold-nanoplating technique is used to monitor differences in the electroche...