Add to ORKGRecent trends towards finer pitch devices and assembly with lead free solders have resulted in increased interest in NiPd plated component leads by the electronics industry. This paper discusses the performance of NiPd fine pitch components as determined by wettability, assembly performance and solder joint reliability. Assembly evaluations were performed with a lead free solder as well as with eutectic SnPb solder. The compatibility of the NiPd component leads with different circuit board finishes (metallic and organic azole) will also be discussed
The option of treating fine pitch wafer level CSP (WLCSP) devices as flip chips and assembling them ...
This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP)...
The 91.84Sn-3.33Ag-4.83Bi and 96.5Sn-3.5Ag Pb-free solders were evaluated for surface mount circuit ...
The suitability of various metallic printed wiring board surface finishes was assessed for new techn...
The solderability performance of tin (Sn)-plated integrated circuit (IC) component leads is assessed...
A nickel/palladium (Ni/Pd) lead finish for integrated circuits (IC) was introduced in 1989. In 1998,...
A overview has been presented on the topic of alternative surface finishes for package I/Os and circ...
A overview has been presented on the topic of alternative surface finishes for package I/Os and circ...
A lead-free surface mounting process was assessed and compared to a conventional leaded one. The ter...
A lead-free surface mounting process was assessed and compared to a conventional leaded one. The ter...
Abstract: According to the EU RoHS Directive many electronic manufactures have had to introduce lead...
This article describes surface finishes which are the most common and well-established at present ti...
Lead-free Printed Circuit Board (PCB) assembly evaluation was undertaken to determine the effect of ...
Abstract- Removal of lead (Pb) from finished integrated circuit (IC) packages and the assembly proce...
Solder paste is the most widely used interconnection material in the electronic assembly process for...
The option of treating fine pitch wafer level CSP (WLCSP) devices as flip chips and assembling them ...
This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP)...
The 91.84Sn-3.33Ag-4.83Bi and 96.5Sn-3.5Ag Pb-free solders were evaluated for surface mount circuit ...
The suitability of various metallic printed wiring board surface finishes was assessed for new techn...
The solderability performance of tin (Sn)-plated integrated circuit (IC) component leads is assessed...
A nickel/palladium (Ni/Pd) lead finish for integrated circuits (IC) was introduced in 1989. In 1998,...
A overview has been presented on the topic of alternative surface finishes for package I/Os and circ...
A overview has been presented on the topic of alternative surface finishes for package I/Os and circ...
A lead-free surface mounting process was assessed and compared to a conventional leaded one. The ter...
A lead-free surface mounting process was assessed and compared to a conventional leaded one. The ter...
Abstract: According to the EU RoHS Directive many electronic manufactures have had to introduce lead...
This article describes surface finishes which are the most common and well-established at present ti...
Lead-free Printed Circuit Board (PCB) assembly evaluation was undertaken to determine the effect of ...
Abstract- Removal of lead (Pb) from finished integrated circuit (IC) packages and the assembly proce...
Solder paste is the most widely used interconnection material in the electronic assembly process for...
The option of treating fine pitch wafer level CSP (WLCSP) devices as flip chips and assembling them ...
This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP)...
The 91.84Sn-3.33Ag-4.83Bi and 96.5Sn-3.5Ag Pb-free solders were evaluated for surface mount circuit ...