This report provides a summary of results obtained in research supported by contract ''Fundamental Surface Reaction Mechanisms in Fluorocarbon Plasma-Based Processing'' (Contract No. DE-FG0200ER54608). In this program we advanced significantly the scientific knowledge base on low pressure fluorocarbon plasmas used for patterning of dielectric films and for producing fluorocarbon coatings on substrates. We characterized important neutral and ionic gas phase species that are incident at the substrate, and the processes that occur at relevant surfaces in contact with the plasma. The work was performed through collaboration of research groups at three universities where significantly different, complementary tools for plasma and surface charact...
This article reports on the deposition conditions and characterization of plasma polymerized fluoroc...
Surface modifications and etching mechanisms of several nanoporous low-k dielectrics (spin-on and PE...
In the past few years, the physics of low temperature plasmas has received a new stimulus from appli...
This report describes the results obtained during the two and a half years of work on the contract '...
Polymerization processes in low-pressure plasmas used for industrial surface processing are surveyed...
Polymerization processes in low-pressure plasmas used for industrial surface processing are surveyed...
Polymerization processes in low-pressure plasmas used for industrial surface processing are surveyed...
Polymerization processes in low-pressure plasmas used for industrial surface processing are surveyed...
As part of a project with SEMATECH, detailed chemical reaction mechanisms have been developed that d...
The present work deals with the diagnostics of fluorocarbon plasmas by different experimental method...
Using plasma in conjunction with fluorinated compounds is widely encountered in material processing....
Using plasma in conjunction with fluorinated compounds is widely encountered in material processing....
Photolithographic patterning of photoresist materials and transfer of these images into electronic m...
155 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2000.Surface reactions occurring i...
Plasma etching is an essential process in the fabrication of subm cron features in the semiconductor...
This article reports on the deposition conditions and characterization of plasma polymerized fluoroc...
Surface modifications and etching mechanisms of several nanoporous low-k dielectrics (spin-on and PE...
In the past few years, the physics of low temperature plasmas has received a new stimulus from appli...
This report describes the results obtained during the two and a half years of work on the contract '...
Polymerization processes in low-pressure plasmas used for industrial surface processing are surveyed...
Polymerization processes in low-pressure plasmas used for industrial surface processing are surveyed...
Polymerization processes in low-pressure plasmas used for industrial surface processing are surveyed...
Polymerization processes in low-pressure plasmas used for industrial surface processing are surveyed...
As part of a project with SEMATECH, detailed chemical reaction mechanisms have been developed that d...
The present work deals with the diagnostics of fluorocarbon plasmas by different experimental method...
Using plasma in conjunction with fluorinated compounds is widely encountered in material processing....
Using plasma in conjunction with fluorinated compounds is widely encountered in material processing....
Photolithographic patterning of photoresist materials and transfer of these images into electronic m...
155 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2000.Surface reactions occurring i...
Plasma etching is an essential process in the fabrication of subm cron features in the semiconductor...
This article reports on the deposition conditions and characterization of plasma polymerized fluoroc...
Surface modifications and etching mechanisms of several nanoporous low-k dielectrics (spin-on and PE...
In the past few years, the physics of low temperature plasmas has received a new stimulus from appli...