The reaction of Au with GaSb occurs at a relatively low temperature (100 C). Upon annealing, a AuSb{sub 2} compound and several Au-Ga phases are produced. Phase transitions occur toward higher Ga concentration with increasing annealing temperatures. Furthermore, the depth of the contact also increases with increased annealing temperature. They found that the AuSb{sub 2} compound forms on the GaSb surface, with the compound crystal partially ordered with respect to the substrate. The transition of Schottky- to ohmic-contact behavior in Au/n-type GaSb occurs simultaneously with the formation of the AuGa compound at about a 250 C annealing temperature. This ohmic contact forms without the segregation of dopants at the metallic compound/GaSb in...
The utility of thermodynamic potential (activity) diagrams in predicting the reaction zone morpholog...
This paper investigates low temperature ohmic contact formation of Au/Sb to n-type Si substrates thr...
This paper reports on the characteristic changes of Au/GaxIn 1-xSb thermocompressed Gunn diodes afte...
Interfacial reactions between GaSb and Au were studied by Rutherford backscattering, X-ray diffracti...
We analyse the specific contact resistance rho(C) and the interfacial microstructural characteristic...
The microstructure and electrical properties of nonalloyed epitaxial Au‐Ge contacts were studied. Oh...
A comparison of n-GaSb and n-GaInAsSb epilayers for ohmic contacts in GaSb-based devices is studied....
The Au/(InGe) contact to GaAs was investigated to discover the metallurgical structure of the contac...
Good quality ohmic contacts to GaAs microwave devices are of vital importance for the efficient oper...
A study on the microstructure of argon-beam activated n-GaSb/n-Ga0.32In0.68P bond interfaces is pres...
Au/β-Ga2O3 Schottky contacts deposited at room temperature via electron-beam evaporation are charact...
[[abstract]]Thermal stability for Pd/n‐GaSb Schottky contacts is analyzed and studied. At room tempe...
The influence of premetallization surface preparation on the structural, chemical, and electrical pr...
The introduction of a very small amount of Ga into Au contact metallization on InP is shown to have ...
The performance and reliability of semiconductor devices depend critically on the electrical quality...
The utility of thermodynamic potential (activity) diagrams in predicting the reaction zone morpholog...
This paper investigates low temperature ohmic contact formation of Au/Sb to n-type Si substrates thr...
This paper reports on the characteristic changes of Au/GaxIn 1-xSb thermocompressed Gunn diodes afte...
Interfacial reactions between GaSb and Au were studied by Rutherford backscattering, X-ray diffracti...
We analyse the specific contact resistance rho(C) and the interfacial microstructural characteristic...
The microstructure and electrical properties of nonalloyed epitaxial Au‐Ge contacts were studied. Oh...
A comparison of n-GaSb and n-GaInAsSb epilayers for ohmic contacts in GaSb-based devices is studied....
The Au/(InGe) contact to GaAs was investigated to discover the metallurgical structure of the contac...
Good quality ohmic contacts to GaAs microwave devices are of vital importance for the efficient oper...
A study on the microstructure of argon-beam activated n-GaSb/n-Ga0.32In0.68P bond interfaces is pres...
Au/β-Ga2O3 Schottky contacts deposited at room temperature via electron-beam evaporation are charact...
[[abstract]]Thermal stability for Pd/n‐GaSb Schottky contacts is analyzed and studied. At room tempe...
The influence of premetallization surface preparation on the structural, chemical, and electrical pr...
The introduction of a very small amount of Ga into Au contact metallization on InP is shown to have ...
The performance and reliability of semiconductor devices depend critically on the electrical quality...
The utility of thermodynamic potential (activity) diagrams in predicting the reaction zone morpholog...
This paper investigates low temperature ohmic contact formation of Au/Sb to n-type Si substrates thr...
This paper reports on the characteristic changes of Au/GaxIn 1-xSb thermocompressed Gunn diodes afte...