EUVL mask blanks consist of a distributed Bragg reflector made of 6.7nm-pitch bi-layers of MO and Si deposited upon a precision Si or glass substrate. The layer deposition process has been optimized for low defects, by application of a vendor-supplied but highly modified ion-beam sputter deposition system. This system is fully automated using SMIF technology to obtain the lowest possible environmental- and handling-added defect levels. Originally designed to coat 150mm substrates, it was upgraded in July, 1999 to 200 mm and has coated runs of over 50 substrates at a time with median added defects >100nm below 0.05/cm{sup 2}. These improvements have resulted from a number of ion-beam sputter deposition system modifications, upgrades, and ...
We report on growth of low defect density Mo/Si multilayer (ML) coatings. The coatings were grown in...
One of the most important challenges in extreme ultraviolet lithography is the need to provide mask ...
One of the most important challenges in extreme ultraviolet lithography is the need to provide mask ...
Extreme Ultraviolet Lithgraphy (EUVL) is an emerging technology for fabrication of sub-100 nm featur...
In extreme ultraviolet lithography (EUVL), the technology specific requirements on the mask are a di...
EUV mask blanks consist of two thin film systems deposited on low thermal expansion 6 inch substrate...
The mask is deemed one of the areas that require significant research and development in EUVL. Silic...
There's a big push for development and commercialization of extreme ultraviolet (EUV) lithography fo...
Determining the printability of substrate defects beneath the extreme ultraviolet (EUV) reflecting m...
Determining the printability of substrate defects beneath the extreme ultraviolet (EUV) reflecting m...
The ability to fabricate defect-free mask blanks is a well-recognized challenge in enabling extreme ...
The availability of defect-free masks remains one of the key challenges for inserting extreme ultrav...
Extreme ultraviolet lithography (EUVL) is expected to be used in device manufacturing starting at 32...
Extreme Ultraviolet Lithography (EUVL) is the favourite next generation lithography candidate for IC...
The availability of defect-free masks remains one of the key challenges for inserting extreme ultrav...
We report on growth of low defect density Mo/Si multilayer (ML) coatings. The coatings were grown in...
One of the most important challenges in extreme ultraviolet lithography is the need to provide mask ...
One of the most important challenges in extreme ultraviolet lithography is the need to provide mask ...
Extreme Ultraviolet Lithgraphy (EUVL) is an emerging technology for fabrication of sub-100 nm featur...
In extreme ultraviolet lithography (EUVL), the technology specific requirements on the mask are a di...
EUV mask blanks consist of two thin film systems deposited on low thermal expansion 6 inch substrate...
The mask is deemed one of the areas that require significant research and development in EUVL. Silic...
There's a big push for development and commercialization of extreme ultraviolet (EUV) lithography fo...
Determining the printability of substrate defects beneath the extreme ultraviolet (EUV) reflecting m...
Determining the printability of substrate defects beneath the extreme ultraviolet (EUV) reflecting m...
The ability to fabricate defect-free mask blanks is a well-recognized challenge in enabling extreme ...
The availability of defect-free masks remains one of the key challenges for inserting extreme ultrav...
Extreme ultraviolet lithography (EUVL) is expected to be used in device manufacturing starting at 32...
Extreme Ultraviolet Lithography (EUVL) is the favourite next generation lithography candidate for IC...
The availability of defect-free masks remains one of the key challenges for inserting extreme ultrav...
We report on growth of low defect density Mo/Si multilayer (ML) coatings. The coatings were grown in...
One of the most important challenges in extreme ultraviolet lithography is the need to provide mask ...
One of the most important challenges in extreme ultraviolet lithography is the need to provide mask ...