Thermal Analysis of a SHIELD Electromigration Test Structure

The steady state and transient thermal behavior of an electromigration test structure was analyzed. The test structure was a Sandia SHIELD (Self-stressing HIgh fregquency rELiability Device) electromigration test device manufactured by an outside vendor. This device has a high frequency oscillator circuit, a buffer circuit to isolate and drive the metal line to the tested (DUT), the DUT to be electromigrated itself, a metal resistance thermometry monitor, and a heater elment to temperature accelerate the electromigration effect