IBM Endicott, Assembly Process Design, has completed the tenth quarter of development activity on work concerned with high performance, low cost interconnections for flip attach. The scope of work this quarter included paste deposition process development and chip bonding process development
For low-cost applications like smart labels a mounting technology, which allows high throughput, is ...
The attachment of a flip chip of moderate size and pitch to an organic substrate has lost much of it...
This paper describes the successful process investigations on ultrathin flip-chip bonding for fine-p...
This annual report details activities for TRP Flip Chip Attached Project. The IBM/Universal Instrume...
This final report is a compilation of final reports from each of the groups participating in the pro...
The scope of Endicott activity during this quarter includes: paste deposition process development an...
This report emphazised on the two projects assigned to author during IA. The projects are Die Mount ...
In the last leg of the project the major thrust has been on the assembly process using the conductiv...
This report contains two separate reports for the Flip Chip Attach project. The first report is York...
Upon completion of the second year of this contract, we have delivered the next generation of polyme...
Flip-chip assembly, developed in the early 1960s, is now being positioned as a key joining technolog...
The accomplishments are broken down into three different categories: materials development (polymer ...
Automated and cost-efficient manufacturing processes are of paramount importance for low-cost mass p...
An increasing number of flip chip interconnection technologies have emerged during the last few year...
Increasing interest in cost effective flip chip technologies leads to the development of various fle...
For low-cost applications like smart labels a mounting technology, which allows high throughput, is ...
The attachment of a flip chip of moderate size and pitch to an organic substrate has lost much of it...
This paper describes the successful process investigations on ultrathin flip-chip bonding for fine-p...
This annual report details activities for TRP Flip Chip Attached Project. The IBM/Universal Instrume...
This final report is a compilation of final reports from each of the groups participating in the pro...
The scope of Endicott activity during this quarter includes: paste deposition process development an...
This report emphazised on the two projects assigned to author during IA. The projects are Die Mount ...
In the last leg of the project the major thrust has been on the assembly process using the conductiv...
This report contains two separate reports for the Flip Chip Attach project. The first report is York...
Upon completion of the second year of this contract, we have delivered the next generation of polyme...
Flip-chip assembly, developed in the early 1960s, is now being positioned as a key joining technolog...
The accomplishments are broken down into three different categories: materials development (polymer ...
Automated and cost-efficient manufacturing processes are of paramount importance for low-cost mass p...
An increasing number of flip chip interconnection technologies have emerged during the last few year...
Increasing interest in cost effective flip chip technologies leads to the development of various fle...
For low-cost applications like smart labels a mounting technology, which allows high throughput, is ...
The attachment of a flip chip of moderate size and pitch to an organic substrate has lost much of it...
This paper describes the successful process investigations on ultrathin flip-chip bonding for fine-p...
DOI
Add to ORKG