Corrosion in Non-Hermetic Microelectronic Devices

Many types of integrated and discrete microelectronic devices exist in the enduring stockpile. In the past, most of these devices have used conventional ceramic hermetic packaging (CHP) technology. Sometime in the future, plastic encapsulated microelectronic (PEM) devices will almost certainly enter the inventory. In the presence of moisture, several of the aluminum-containing metallization features common to both types of packaging become susceptible to atmospheric corrosion (Figure 1). A breach in hermeticity (e.g., due to a crack in the ceramic body or lid seal) could allow moisture and/or contamination to enter the interior of a CHP device. For PEM components, the epoxy encapsulant material is inherently permeable to moisture. A multi-year project is now underway at Sandia to develop the knowledge base and analytical tools needed to quantitatively predict the effect of corrosion on microelectronic performance and reliability. The issue of corrosion-induced failure surfaced twice during the past year because cracks were found in their ceramic bodies of two different CHP devices: the SA371 1/3712 MOSFET and the SA3935 ASIC (acronym for A Simple Integrated Circuit). Because of our inability to perform a model-based prediction at that time, the decision was made to determine the validity of the corrosion concern for these specific situations by characterizing the expected environment and assessing its relative degree of corrosivity. The results of this study are briefly described in this paper along with some of the advancements made with the predictive model development