Thermal performance of phase change wallboard for residential cooling application

Cooling of residential California buildings contributes significantly to electrical consumption and peak power demand mainly due to very poor load factors in milder climates. Thermal mass can be utilized to reduce the peak-power demand, downsize the cooling systems, and/or switch to low-energy cooling sources. Large thermal storage devices have been used in the past to overcome the shortcomings of alternative cooling sources, or to avoid high demand charges. The manufacturing of phase change material (PCM) implemented in gypsum board, plaster or other wall-covering material, would permit the thermal storage to become part of the building structure. PCMs have two important advantages as storage media: they can offer an order-of-magnitude increase in thermal storage capacity, and their discharge is almost isothermal. This allows the storage of high amounts of energy without significantly changing the temperature of the room envelope. As heat storage takes place inside the building, where the loads occur, rather than externally, additional transport energy is not required. RADCOOL, a thermal building simulation program based on the finite difference approach, was used to numerically evaluate the latent storage performance of treated wallboard. Extended storage capacity obtained by using double PCM-wallboard is able to keep the room temperatures close to the upper comfort limits without using mechanical cooling. Simulation results for a living room with high internal loads and weather data for Sunnyvale, California, show significant reduction of room air temperature when heat can be stored in PCM-treated wallboards