Material removal in chemical mechanical polishing (CMP) occurs by a pressure accentuated chemical attack of the surface. The polishing slurry typically consists of abrasive particles and reactive chemicals that may or may not include an oxidant. Post-CMP cleaning processes must remove both the ionic contaminants and any remaining polishing slurry particles. Central to the effectiveness of a clean is the use of conditions that will minimize the binding force between the residual particles and the wafer surface. The morphology and composition of the particle, the surface from which it must be removed, and the environment surrounding the wafer will determine the magnitude of forces that hold a particle to the wafer surface. At the Sandia/SEMAT...
With shrinkage of the minimum feature size to sub-14 nm, grain topography and protrusion/dishing iss...
Chemical mechanical polishing (CMP) with fixed abrasive pad is an alternative machining method to lo...
High precision optical components are required for modern life and future. To achieve component’s su...
Chemical-mechanical polishing (CMP) has emerged as a new processing technique for achieving a high d...
By theoretical calculation, the external force on the particle conveyed by pad asperities and the mo...
The process of chemical mechanical polishing (CMP) can be studied using in situ atomic force microsc...
Research was performed to study the particle adhesion on the wafer surface after the chemical-mechan...
This paper provides a tribochemical study of the selective layer surface by chemical mechanical plan...
Abstract: Chemical Mechanical Polishing (CMP) has become the most widely used planarization technolo...
In this paper, the mechanisms of material removal in chemical mechanical polishing (CMP) processes a...
This work extended the current fundamental models for particles adhering to thin films. Particle rem...
The essential parts of interconnects for silicon based logic and memory devices consist of metal wir...
The Chemical Mechanical polishing (CMP) process is now widely employed in the Integrated Circuit Fab...
Le polissage mécano-chimique (CMP pour Chemical Mechanical Polishing) consiste à appliquer une suspe...
403-405Nanoparticles have been widely used in oils and polish slurry such as chemical mechanical pol...
With shrinkage of the minimum feature size to sub-14 nm, grain topography and protrusion/dishing iss...
Chemical mechanical polishing (CMP) with fixed abrasive pad is an alternative machining method to lo...
High precision optical components are required for modern life and future. To achieve component’s su...
Chemical-mechanical polishing (CMP) has emerged as a new processing technique for achieving a high d...
By theoretical calculation, the external force on the particle conveyed by pad asperities and the mo...
The process of chemical mechanical polishing (CMP) can be studied using in situ atomic force microsc...
Research was performed to study the particle adhesion on the wafer surface after the chemical-mechan...
This paper provides a tribochemical study of the selective layer surface by chemical mechanical plan...
Abstract: Chemical Mechanical Polishing (CMP) has become the most widely used planarization technolo...
In this paper, the mechanisms of material removal in chemical mechanical polishing (CMP) processes a...
This work extended the current fundamental models for particles adhering to thin films. Particle rem...
The essential parts of interconnects for silicon based logic and memory devices consist of metal wir...
The Chemical Mechanical polishing (CMP) process is now widely employed in the Integrated Circuit Fab...
Le polissage mécano-chimique (CMP pour Chemical Mechanical Polishing) consiste à appliquer une suspe...
403-405Nanoparticles have been widely used in oils and polish slurry such as chemical mechanical pol...
With shrinkage of the minimum feature size to sub-14 nm, grain topography and protrusion/dishing iss...
Chemical mechanical polishing (CMP) with fixed abrasive pad is an alternative machining method to lo...
High precision optical components are required for modern life and future. To achieve component’s su...