Design and Testing of Metal and Silicon Heat Spreaders with Embedded Micromachined Heat Pipes

The authors have developed a new type of heat spreader based on the integration of heat pipes directly within a thin planar structure suitable for use as a heat spreader or as the base layer in a substrate. The process uses micromachining methods to produce micron scale patterns that act as a wick in these small scale heat pipes. By using silicon or a low expansion metal as the wall material of these spreaders, they achieve a good match to the thermal coefficient of expansion of the die. The match allows the use of a thin high performance die attachment even on large size die. The embedded heat pipes result in high effective thermal conductivity for the new spreader technology