We present a methodology based on finite-element modeling of nanoindentation data to extract reliable and accurate mechanical properties from thin, hard films and surface-modified layers on softer substrates. The method deduces the yield stress, Young`s modulus, and hardness from indentations as deep as 50% of the layer thickness
Nanoindentation is a widely recognized method for characterizing the mechanical properties of thin f...
Current developments and trends in microelectronics are focused on thin layers and novel materials. ...
Results from several series of experimental investigations are described, which, it is hoped, will i...
The mechanical properties of implanted layers and thin films on dissimilar substrates are difficult ...
The nanoindentation experiment is an established technique for the determination of Hardness and You...
Nanoindentation technique is commonly used to characterize the mechanical properties of thin films. ...
The properties of the materials involved in the set-up of 3D ICs need to be known, when the occurrin...
One of the major topics in novel microelectronics are thin film materials - especially their mechani...
Simple equations are proposed for determining elastic modulus and hardness properties of thin films ...
Obtaining material data for thin metal layers is a mayor issue in the reliability assessment of micr...
This study explores the difficulties encountered when using conventional nanoindentation techniques ...
In the present paper, the hardness and Young's modulus of film-substrate systems are determined by m...
A deconvolution method that combines nanoindentation testing with finite element analysis was develo...
Current developments and trends in microelectronics are focused on thin layers and novel materials. ...
Nanoindentation is one of the most known method for investigating the properties of thin films. The ...
Nanoindentation is a widely recognized method for characterizing the mechanical properties of thin f...
Current developments and trends in microelectronics are focused on thin layers and novel materials. ...
Results from several series of experimental investigations are described, which, it is hoped, will i...
The mechanical properties of implanted layers and thin films on dissimilar substrates are difficult ...
The nanoindentation experiment is an established technique for the determination of Hardness and You...
Nanoindentation technique is commonly used to characterize the mechanical properties of thin films. ...
The properties of the materials involved in the set-up of 3D ICs need to be known, when the occurrin...
One of the major topics in novel microelectronics are thin film materials - especially their mechani...
Simple equations are proposed for determining elastic modulus and hardness properties of thin films ...
Obtaining material data for thin metal layers is a mayor issue in the reliability assessment of micr...
This study explores the difficulties encountered when using conventional nanoindentation techniques ...
In the present paper, the hardness and Young's modulus of film-substrate systems are determined by m...
A deconvolution method that combines nanoindentation testing with finite element analysis was develo...
Current developments and trends in microelectronics are focused on thin layers and novel materials. ...
Nanoindentation is one of the most known method for investigating the properties of thin films. The ...
Nanoindentation is a widely recognized method for characterizing the mechanical properties of thin f...
Current developments and trends in microelectronics are focused on thin layers and novel materials. ...
Results from several series of experimental investigations are described, which, it is hoped, will i...