Determining bonding quality in polymer composites with a millimeter wave sensor

Microwave nondestructive testing (NDT) techniques offer alternative solutions to other conventional NDT methods. Microwave/millimeter wave (determined roughly to cover 0.3 to 300 GHz) techniques are particularly useful for examination of dielectric composite materials that their low dielectric losses provide good depth of penetration of electromagnetic radiation in this band. Limitations associated with conventional NDT techniques such as high frequency ultrasonic testing (UT), namely, large variations in elastic properties of low density composite materials cause interpretation of complex UT signals difficult. Further, criticality of coupling of transducer to the sample surface limits the use of such techniques for on-line applications. High frequency microwave (millimeter waves, 30--300 GHz) systems compared to their low frequency counterparts offer higher resolution and sensitivity to variations in dielectric properties of low-loss composites. Further, higher frequencies render utilization of more compact systems which are often important for practical applications. A millimeter wave sensor is described in this work which can be utilized for non-contact NDT of a wide range of thin-sheet dielectric composite materials either as a laboratory-based instrument or for on-line quality control applications. Experimental results are presented on noncontact measurement of bonding quality in polyethylene/carbon composite samples. The w-band monostatic sensor operates based on measurement of the reflection properties of the material under test, which are then used to determine the volumetric uniformity of the joint area. Preliminary experimental results indicate the potential for the use of this sensor in fabrication process control of low-loss dielectric composite materials