Surface morphology and microstructure of Al-O alloys grown by ECR plasma deposition

The growth of polycrystalline and amorphous aluminum-oxygen alloy films using electron-beam evaporation of Al in the presence of an O{sub 2} electron-cyclotron-resonance (ECR) plasma was investigated for film compositions varying from 40% Al (Al{sub 2}O{sub 3}) to near 100% Al (AlO{sub x}). Processing parameters such as deposition temperature and ion energy were varied to study their effects on surface texture and film microstructure. The Al-rich films (AlO{sub x}) contain polycrystalline fcc Al grains with finely dispersed second-phase particles of {gamma}-Al{sub 2}O{sub 3} (1-2 nm in size). The surface roughness of these films was measured by atomic force microscopy and found to increase with sample bias and deposition temperature. Stoichiometric Al{sub 2}O{sub 3} films grown at 100{degrees}C and 400{degrees}C without an applied bias were amorphous, while an applied bias of -140 V formed a nanocrystalline {gamma}-Al{sub 2}O{sub 3} film at 400{degrees}C. The surface roughness of the Al{sub 2}O{sub 3} increased with temperature while ion irradiation produced a smoother surface