The Effect of Excimer Laser Treatment on the Surface Roughness and Fracture Strength of Alumina Substrates

The microelectronics industry requires alumina substrates with exceptionally smooth surfaces and few surface defects to allow successful deposition of metallic films for reliable electronic performance. Irradiation by a 248-nm wavelength excimer laser beam (KrF) at a fluence of 125 mJ/mm{sup 2} and at various angles of incidence is shown to significantly reduce the surface roughness of alumina substrates. However, irradiation also creates a fine particulate deposit of alumina that only partially adheres to the substrate and impedes deposition of metal films. Annealing in air between 1350 C and 1450 C was found to remove the particles by sintering. As-received material showed surface roughness average (R{sub a}) mean values of 457 nm, which was reduced to 60 nm (mean) following irradiation and 71 nm (mean) following irradiation and annealing at 1350 C. Irradiation also produced a decrease in the number and severity of surface defects. The flexural strength and Weibull modulus were both increased by laser irradiation and thermal treatment. Flexural strength went from an as-received value of 450 MPa to 560 MPa following irradiation/sintering, measured at 10% probability of failure. The Weibull modulus was increased from the as-received value of about 9, to about 13 following irradiation/sintering. It was concluded that irradiation at an angle of incidence of 60{degree} from perpendicular was most effective in producing a low surface roughness