In this thesis the geometrical configuration of a processor heat sink is optimized. Two objective functions, operational cost and maximum temperature, have been chosen and the design space has been limited to three degrees of freedom represented by number of fins, fin height and fin thickness. The optimization is simulation-based and carried out using multi-objective particle swarm optimization (MO-PSO). Two variants of MO-PSO have been selected, adapted and implemented. The first is a variant introduced by Coello and Lechuga in "MOPSO: A Proposal for Multiple Objective Particle Swarm Optimization" which is based on density of the pareto front. The second is a variant introduced by Fieldsend and Singh in "A Multi-Objective Algorithm Based U...
Purpose The purpose of the study is to optimise the cross-sectional shape of passively cooled horiz...
Plate Fin Heat Sinks (PFHS) are among the simplest and most widespread devices for electronics cooli...
Cooling electronic chips to satisfy the ever-increasing heat transfer demands of the electronics ind...
Single and multi-objective thermal performance of heat sink are considered using evolutionary optimi...
Particle Swarm Optimization (PSO) is an evolutionary computation technique, which has been inspired ...
For the multi-objective design of heat sinks, several evolutionary algorithms usually require many i...
This study explores the application of Particle Swarm Optimization (PSO) for optimization of a cross...
ii Particle Swarm Optimization (PSO) is an evolutionary computation technique, which has been inspir...
A multi-objective structural design of a serpentine channel heat sink is presented in this paper. In...
In the present work, the performance of the particle swarm optimization and the genetic algorithm co...
Fins and fin arrays with constant temperature at the fin base have known solutions for natural conve...
Abstract—In the present work, the performance of the particle swarm optimization and the genetic alg...
The thermal management is an ever increasing challenge in advanced electronic devices. In this paper...
Particle swarm optimization (PSO) is employed to investigate the overall performance of a pin fin.Th...
This paper presents the comparative performance of several surrogate-assisted multiobjective evoluti...
Purpose The purpose of the study is to optimise the cross-sectional shape of passively cooled horiz...
Plate Fin Heat Sinks (PFHS) are among the simplest and most widespread devices for electronics cooli...
Cooling electronic chips to satisfy the ever-increasing heat transfer demands of the electronics ind...
Single and multi-objective thermal performance of heat sink are considered using evolutionary optimi...
Particle Swarm Optimization (PSO) is an evolutionary computation technique, which has been inspired ...
For the multi-objective design of heat sinks, several evolutionary algorithms usually require many i...
This study explores the application of Particle Swarm Optimization (PSO) for optimization of a cross...
ii Particle Swarm Optimization (PSO) is an evolutionary computation technique, which has been inspir...
A multi-objective structural design of a serpentine channel heat sink is presented in this paper. In...
In the present work, the performance of the particle swarm optimization and the genetic algorithm co...
Fins and fin arrays with constant temperature at the fin base have known solutions for natural conve...
Abstract—In the present work, the performance of the particle swarm optimization and the genetic alg...
The thermal management is an ever increasing challenge in advanced electronic devices. In this paper...
Particle swarm optimization (PSO) is employed to investigate the overall performance of a pin fin.Th...
This paper presents the comparative performance of several surrogate-assisted multiobjective evoluti...
Purpose The purpose of the study is to optimise the cross-sectional shape of passively cooled horiz...
Plate Fin Heat Sinks (PFHS) are among the simplest and most widespread devices for electronics cooli...
Cooling electronic chips to satisfy the ever-increasing heat transfer demands of the electronics ind...